Specification	SS-112-TT-2

Connector Type	Receptacle
Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Length - Post	0.125 in
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Mounting Type	Through Hole
Number of Positions	12
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

SS Series

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Part	Style	Fastening Type	Number of Positions	Number of Positions Loaded	Number of Rows	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Contact Finish Thickness - Mating	Contact Finish - Post	Pitch - Mating	Contact Type	Mounting Type	Insulation Height	Contact Finish - Mating	Insulation Color	Termination	Contact Length - Post	Insulation Material	Contact Shape	Contact Finish Thickness - Post	Contact Material
Samtec Inc. SS-132-G-1C	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.26 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-TT-1A-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle		Tin	0.1 in	Female Socket	Through Hole	0.1 in	Tin	Black	Solder	0.36 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-21C	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.26 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-T-38-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Tin	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.18 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-18	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder		Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-TT-2	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle		Tin	0.1 in	Female Socket	Through Hole	0.1 in	Tin	Black	Solder	0.125 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-S-22	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	10 µin	Tin	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.125 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-29-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder		Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-T-18-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Tin	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder		Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-22	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.125 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper

Pricing

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CAD

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Documents

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Product Drawing (PDF)

SS-112-TT-2 | Datasheet