12-0503-30

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Aries Electronics

CONN SOCKET SIP 12POS GOLD

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Aries Electronics

CONN SOCKET SIP 12POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	12-0503-30

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Housing Material	Polyamide (PA), Nylon, Glass Filled
Material Flammability Rating	UL94 HB
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	12
Number of Positions or Pins (Grid) [custom]	1 x 12
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.5 in
Termination Post Length	12.7 mm
Type	SIP

Part	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Termination	Pitch - Post	Pitch - Post	Current Rating (Amps)	Type	Contact Material - Mating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Mounting Type	Housing Material	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 12-0503-30	1 x 12	12	Gold	0.1 in	2.54 mm	30 Áin	0.76 Ám	UL94 HB	Wire Wrap	2.54 mm	0.1 in	3 A	SIP	Beryllium Copper	0.5 in	12.7 mm	200 µin	5.08 µm	Tin	Through Hole	Polyamide (PA) Nylon Glass Filled	Brass
Aries Electronics 12-0503-20	1 x 12	12	Gold	0.1 in	2.54 mm	30 Áin	0.76 Ám	UL94 HB	Wire Wrap	2.54 mm	0.1 in	3 A	SIP	Beryllium Copper			200 µin	5.08 µm	Tin	Through Hole	Polyamide (PA) Nylon Glass Filled	Brass	0.36 in	9.14 mm
Aries Electronics 12-0503-31	1 x 12	12	Gold	0.1 in	2.54 mm	30 Áin	0.76 Ám	UL94 HB	Wire Wrap	2.54 mm	0.1 in	3 A	SIP	Beryllium Copper	0.5 in	12.7 mm	10 çin	0.25 çm	Gold	Through Hole	Polyamide (PA) Nylon Glass Filled	Brass
Aries Electronics 12-0503-21	1 x 12	12	Gold	0.1 in	2.54 mm	30 Áin	0.76 Ám	UL94 HB	Wire Wrap	2.54 mm	0.1 in	3 A	SIP	Beryllium Copper			10 çin	0.25 çm	Gold	Through Hole	Polyamide (PA) Nylon Glass Filled	Brass	0.36 in	9.14 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	82	$ 5.91

General part information

12 (1 x 12) Pos SIP Socket Gold Through Hole

Technical documentation and resources