Specification	XCVP1502-2MLEVSVA2785

Architecture	MPU, FPGA
Connectivity	USART, SD, USB OTG, CANbus, MMC, EBI, UART, Ethernet, SPI, I2C, SDIO, EMI
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	0 °C
Package / Case	2785-BFBGA
Package Length	50 mm
Package Name	2785-BGA
Package Width	50 mm
Peripherals	DDR, DMA, PCIe
Primary Attributes	Versal™ Premium FPGA, 3.7M Logic Cells
Speed	1.4 GHz, 600 MHz

XCVP1502 Series

Part	Primary Attributes	Operating Temperature (Max)	Operating Temperature (Min)	Connectivity	Peripherals	Package / Case	Core Processor	Speed	Architecture	Package Name	Package Width	Package Length
AMD / Xilinx XCVP1502-2MLEVSVA2785	3.7M Logic Cells Versal™ Premium FPGA	100 °C	0 °C	CANbus EBI EMI Ethernet I2C MMC SD SDIO SPI UART USART USB OTG	DDR DMA PCIe	2785-BFBGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™ Dual ARM®Cortex™-R5F with CoreSight™	1.4 GHz 600 MHz	FPGA MPU	2785-BGA	50 mm	50 mm

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