HMTSW-202-09-G-S-508

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 2 POS 5.08MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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HMTSW-202-09-G-S-508

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 2 POS 5.08MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-202-09-G-S-508

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	12.9 mm
Contact Length - Mating	0.508 in
Contact Length - Post	0.122 "
Contact Length - Post	3.1 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	2
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	0.73 in
Overall Contact Length	18.54 mm
Pitch - Mating	5.08 mm
Pitch - Mating	0.2 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HMTSW-202 Series

Part	Contact Length - Post [x]	Contact Length - Post [x]	Mounting Type	Shrouding	Fastening Type	Contact Length - Mating	Contact Length - Mating	Insulation Material	Style	Insulation Color	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions	Termination	Contact Shape	Insulation Height	Insulation Height	Current Rating (Amps)	Material Flammability Rating	Number of Rows	Contact Material	Contact Finish - Post	Connector Type	Pitch - Mating	Pitch - Mating	Contact Type	Overall Contact Length	Overall Contact Length	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Overall Contact Length [x]	Overall Contact Length [x]	Contact Length - Post	Contact Length - Post	Contact Length - Mating [x]	Contact Length - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Row Spacing - Mating [x]	Row Spacing - Mating [x]
Samtec Inc. HMTSW-202-24-TM-S-120	0.26 in	6.6 mm	Through Hole	Unshrouded	Push-Pull	3.05 mm	0.12 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	105 ░C	-55 °C	2	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	1	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin	0.48 in	12.19 mm	All
Samtec Inc. HMTSW-202-10-L-S-360-RA			Through Hole Right Angle	Unshrouded	Push-Pull	9.14 mm	0.36 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	125 °C	-55 °C	2	Solder	Square	0.122 in	3.1 mm	3 A	UL94 V-0	1	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin			All	10 çin	0.25 çm	Gold
Samtec Inc. HMTSW-202-22-L-S-400			Through Hole	Unshrouded	Push-Pull	10.16 mm	0.4 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	125 °C	-55 °C	2	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	1	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin			All	10 çin	0.25 çm	Gold	0.63 "	16 mm	0.13 in	3.3 mm
Samtec Inc. HMTSW-202-09-S-S-480	0.15 in	3.81 mm	Through Hole	Unshrouded	Push-Pull			Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	125 °C	-55 °C	2	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	1	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin	0.73 in	18.54 mm	All	30 Áin	0.76 Ám	Gold					0.48 in	12.19 mm
Samtec Inc. HMTSW-202-24-T-S-290			Through Hole	Unshrouded	Push-Pull	7.37 mm	0.29 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	105 ░C	-55 °C	2	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	1	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin	0.48 in	12.19 mm	All						0.09 "	2.29 mm
Samtec Inc. HMTSW-202-08-G-S-340			Through Hole	Unshrouded	Push-Pull	8.64 mm	0.34 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	125 °C	-55 °C	2	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	1	Phosphor Bronze	Gold	Header	5.08 mm	0.2 in	Male Pin	0.53 in	13.46 mm	All	10 çin	0.25 çm	Gold			0.09 "	2.29 mm			3 µin	0.076 µm
Samtec Inc. HMTSW-202-09-G-S-508			Through Hole	Unshrouded	Push-Pull	12.9 mm	0.508 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	125 °C	-55 °C	2	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	1	Phosphor Bronze	Gold	Header	5.08 mm	0.2 in	Male Pin	0.73 in	18.54 mm	All	10 çin	0.25 çm	Gold			0.122 "	3.1 mm			3 µin	0.076 µm
Samtec Inc. HMTSW-202-07-L-S-090-RA			Through Hole Right Angle	Unshrouded	Push-Pull	2.29 mm	0.09 in	Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	125 °C	-55 °C	2	Solder	Square	0.122 in	3.1 mm	3 A	UL94 V-0	1	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin			All	10 çin	0.25 çm	Gold
Samtec Inc. HMTSW-202-09-T-T-540			Through Hole	Unshrouded	Push-Pull			Liquid Crystal Polymer (LCP)	Board to Board Cable	Natural	105 ░C	-55 °C	6	Solder	Square	0.1 in	2.54 mm	3 A	UL94 V-0	3	Phosphor Bronze	Tin	Header	5.08 mm	0.2 in	Male Pin	0.73 in	18.54 mm	All						0.09 "	2.29 mm					2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	1	$ 0.60
		50	$ 0.49
		100	$ 0.42
Digikey	Bulk	1	$ 0.97

Description

General part information

HMTSW-202 Series

Connector Header Through Hole 2 position 0.200" (5.08mm)

Documents

Technical documentation and resources