HEF4069UBTT-Q100J

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Nexperia USA Inc.

IC INVERTER 6CH 1-INP 14TSSOP

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HEF4069UBTT-Q100J

Active

Nexperia USA Inc.

IC INVERTER 6CH 1-INP 14TSSOP

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Description Specifications Series Pricing CAD Documents

Description

General part information

HEF4069UBTT-Q100 Series

The HEF4069UB-Q100 is a hex unbuffered inverter. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VDD.

Technical Specifications

Parameters and characteristics for this part

Specification	HEF4069UBTT-Q100J

Current - Output High	3.4 mA
Current - Output Low	3.4 mA
Current - Quiescent (Max)	1 µA
Grade	Automotive
Input Logic Level - High (Max)	12.5 V
Input Logic Level - High (Min)	4 V
Input Logic Level - Low (Max)	2.5 V
Input Logic Level - Low (Min)	1 V
Logic Type	Inverter
Max CL	50 pF
Max Propagation Delay	30 ns
Mounting Type	Surface Mount
Number of Circuits	6
Number of Inputs	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package Length	0.173 in
Package Name	14-TSSOP
Package Width	4.4 mm
Qualification	AEC-Q100
Voltage - Supply (Maximum)	15 V
Voltage - Supply (Minimum)	3 V

HEF4069UBTT-Q100 Series

Hex unbuffered inverter

Part	Mounting Type	Current - Quiescent (Max)	Package Name	Max Propagation Delay	Max CL	Qualification	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Number of Inputs	Package Width	Package Length	Operating Temperature (Max)	Operating Temperature (Min)	Current - Output Low	Current - Output High	Input Logic Level - Low (Max)	Input Logic Level - Low (Min)	Input Logic Level - High (Min)	Input Logic Level - High (Max)	Logic Type	Number of Circuits	Grade
Nexperia USA Inc. HEF4069UBTT-Q100J	Surface Mount	1 µA	14-TSSOP	30 ns	50 pF	AEC-Q100	3 V	15 V	1	4.4 mm	0.173 in	125 °C	-40 °C	3.4 mA	3.4 mA	2.5 V	1 V	4 V	12.5 V	Inverter	6	Automotive

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

HEF4069UBTT-Q100 Nexperia Product Reliability

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body

Pin FMEA HEF4000 family

Footprint for wave soldering

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body

TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation

Nexperia package poster