Specification	0805Y1000222MXTE03

Applications	Decoupling, Boardflex Sensitive, Bypass
Capacitance	2200 pF
Features	Soft Termination, Low ESL (X2Y)
Height (Max)	0.045 in
Mounting Type	Surface Mount, MLCC
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Package / Case	0805 (2012 Metric)
Size / Dimension Length	0.079 in
Size / Dimension Width	0.049 in
Temperature Coefficient	X7R
Thickness (Max)	0.045 in
Tolerance	20 %
Voltage - Rated	100 VAC/DC

X2Y IPC - E03 Series

Part	Height (Max)	Temperature Coefficient	Operating Temperature (Max)	Operating Temperature (Min)	Thickness (Max)	Size / Dimension Length	Size / Dimension Width	Package / Case	Tolerance	Mounting Type	Voltage - Rated	Features	Capacitance	Applications
Knowles Syfer 1410Y1000104MXTE03	0.079 in	X7R	125 °C	-55 °C	0.079 in	0.142 in	0.098 in	1410 (3727 Metric)	20 %	MLCC Surface Mount	100 VAC/DC	Low ESL (X2Y) Soft Termination	0.1 µF	Boardflex Sensitive Bypass Decoupling
Knowles Syfer 1206Y0500104MXTE03	0.051 in	X7R	125 °C	-55 °C	0.051 in	0.126 in	0.063 in	1206 (3216 Metric)	20 %	MLCC Surface Mount	50 V	Low ESL (X2Y) Soft Termination	0.1 µF	Boardflex Sensitive Bypass Decoupling
Knowles Syfer 0805Y1000222MXTE03	0.045 in	X7R	125 °C	-55 °C	0.045 in	0.079 in	0.049 in	0805 (2012 Metric)	20 %	MLCC Surface Mount	100 VAC/DC	Low ESL (X2Y) Soft Termination	2200 pF	Boardflex Sensitive Bypass Decoupling

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