Specification	BGM240PA32VNA3

Antenna Type	Chip, Integrated
Current - Receiving (Max)	5.2 mA
Current - Receiving (Min)	4.5 mA
Current - Transmitting (Max)	154.8 mA
Current - Transmitting (Min)	4.8 mA
Data Rate	2 Mbps
Frequency	2.4 GHz
Memory Size	256 kB
Memory Size (Flash)	1.5 MB
Memory Type	RAM, Flash
Modulation	GFSK
Mounting Type	Surface Mount
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Package / Case	36-SMD Module
Power - Output	20 dBm
Protocol	Bluetooth v5.4
RF Family/Standard	Bluetooth
Sensitivity	-106.5 dBm
Serial Interfaces	GPIO, JTAG, I2S, SPI, UART, USART, I2C, IrDA
Utilized IC / Part	EFR32BG24
Voltage - Supply (Maximum)	3.8 V
Voltage - Supply (Minimum)	1.8 V

BGM240P Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Modulation	Data Rate	Antenna Type	Frequency	RF Family/Standard	Utilized IC / Part	Mounting Type	Sensitivity	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Memory Size (Flash)	Memory Type	Memory Size	Current - Receiving (Min)	Current - Receiving (Max)	Power - Output	Current - Transmitting (Max)	Current - Transmitting (Min)	Serial Interfaces	Protocol	Package / Case
SILICON LABS BGM240PA32VNA3	105 °C	-40 °C	GFSK	2 Mbps	Chip Integrated	2.4 GHz	Bluetooth	EFR32BG24	Surface Mount	-106.5 dBm	1.8 V	3.8 V	1.5 MB	Flash RAM	256 kB	4.5 mA	5.2 mA	20 dBm	154.8 mA	4.8 mA	GPIO I2C I2S IrDA JTAG SPI UART USART	Bluetooth v5.4	36-SMD Module
SILICON LABS BGM240PB22VNA3	105 °C	-40 °C	GFSK	2 Mbps	Chip Integrated	2.4 GHz	Bluetooth	EFR32BG24	Surface Mount	-106.5 dBm	1.8 V	3.8 V	1.5 MB	Flash RAM	256 kB	4.5 mA	5.2 mA	10 dBm	154.8 mA	4.8 mA	GPIO I2C I2S IrDA JTAG SPI UART USART	Bluetooth v5.4	36-SMD Module

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