
PMZB200UNEYL
ActiveNexperia USA Inc.
MOSFET N-CH 30V 1.4A DFN1006B-3

PMZB200UNEYL
ActiveNexperia USA Inc.
MOSFET N-CH 30V 1.4A DFN1006B-3
Description
General part information
PMZB200 Series
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMZB200UNEYL |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 1.4 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 1.5 V |
| Drive Voltage (Min Rds On) | 4.5 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 2.7 nC, 2.7 nC |
| Input Capacitance (Ciss) (Max) | 89 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 3-XFDFN |
| Package Name | DFN1006B-3 |
| Power Dissipation (Max) | 350 mW, 6.25 W |
| Rds On (Max) | 250 mOhm, 250 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 8 V |
| Vgs(th) (Max) | 950 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Power MOSFET frequently asked questions and answers
Thermal performance of DFN packages
DFN1006B-3; Reel pack for SMD, 7"; Q3/T4 product orientation
RC Thermal Models
LFPAK MOSFET thermal design guide - Part 2
Reflow soldering profile
LFPAK MOSFET thermal design guide, Chinese version
Using power MOSFETs in parallel
plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1 mm x 0.6 mm x 0.37 mm body
适合移动和便携式设备的 大批量小信号MOSFET, 采用WLCSP和无引脚DFN封装
Nexperia package poster
plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1.0 mm x 0.6 mm x 0.37 mm body
Questions about package outline drawings
High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages