1107254-08

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Aries Electronics

SOCKET ADAPTER DIP TO 8DIP 0.3

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Aries Electronics

SOCKET ADAPTER DIP TO 8DIP 0.3

Technical Specifications

Parameters and characteristics for this part

Specification	1107254-08

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	15.24 mm
Convert From (Adapter End)	DIP
Convert From (Adapter End)	0.6 in
Convert To (Adapter End)	0.3 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	7.62 mm
Current Rating (Amps)	3 A
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Pins	8
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.3 mm
Termination Post Length	0.13 in

Part	Current Rating (Amps)	Contact Material - Post [custom]	Housing Material	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Pins	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Mounting Type	Termination	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Termination Post Length	Termination Post Length
Aries Electronics 1107254-08	3 A	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	30 Áin	0.76 Ám	8	0.1 in	2.54 mm	Tin	0.3 in	DIP	7.62 mm	15.24 mm	DIP	0.6 in	Through Hole	Solder	2.54 mm	0.1 in	200 µin	5.08 µm	Beryllium Copper	UL94 V-0	3.3 mm	0.13 in
Aries Electronics 1107254-36	3 A	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	30 Áin	0.76 Ám	36	0.1 in	2.54 mm	Tin	0.3 in	DIP	7.62 mm	15.24 mm	DIP	0.6 in	Through Hole	Solder	2.54 mm	0.1 in	200 µin	5.08 µm	Beryllium Copper	UL94 V-0	3.3 mm	0.13 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	54	$ 8.90

General part information

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole

Technical documentation and resources