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TPS84621RUQT

Active
Texas Instruments

2.95-V TO 14.5-V INPUT, 6-A SYNCHRONOUS BUCK, INTEGRATED POWER SOLUTION

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TPS84621RUQT - https://ti.com/content/dam/ticom/images/products/package/r/ruq0047a.png

TPS84621RUQT

Active
Texas Instruments

2.95-V TO 14.5-V INPUT, 6-A SYNCHRONOUS BUCK, INTEGRATED POWER SOLUTION

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTPS84621RUQTTPS84621 Series
ApplicationsITE (Commercial)ITE (Commercial)
Control FeaturesEnable, Active HighEnable, Active High
Current - Output (Max) [Max]6 A6 A
FeaturesUVLOUVLO
Mounting TypeSurface MountSurface Mount
Number of Outputs11
Operating Temperature [Max]85 °C85 °C
Operating Temperature [Min]-40 °C-40 °C
Package / Case47-BQFN Module47-BQFN Module
Size / Dimension [x]0.59 "0.59 "
Size / Dimension [x]15 mm15 mm
Size / Dimension [y]9 mm9 mm
Size / Dimension [y]0.35 "0.35 "
Size / Dimension [z]2.8 mm2.8 mm
Size / Dimension [z]0.11 in0.11 in
Supplier Device Package47-B1QFN (15x9)47-B1QFN (15x9)
TypeNon-Isolated PoL ModuleNon-Isolated PoL Module
Voltage - Input (Min) [Min]4.5 V4.5 V
Voltage - Output 1 [Max]5.5 V5.5 V
Voltage - Output 1 [Min]0.6 V0.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

TPS84621 Series

2.95-V to 14.5-V Input, 6-A Synchronous Buck, Integrated Power Solution

PartOperating Temperature [Min]Operating Temperature [Max]Supplier Device PackagePackage / CaseFeaturesSize / Dimension [z]Size / Dimension [y]Size / Dimension [z]Size / Dimension [y]Size / Dimension [x]Size / Dimension [x]ApplicationsVoltage - Output 1 [Min]Voltage - Output 1 [Max]Mounting TypeVoltage - Input (Min) [Min]TypeCurrent - Output (Max) [Max]Number of OutputsControl Features
Texas Instruments
TPS84621RUQR
The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84621 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques. The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84621 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
-40 °C
85 °C
47-B1QFN (15x9)
47-BQFN Module
UVLO
2.8 mm
9 mm
0.11 in
0.35 "
0.59 "
15 mm
ITE (Commercial)
0.6 V
5.5 V
Surface Mount
4.5 V
Non-Isolated PoL Module
6 A
1
Active High, Enable
Texas Instruments
TPS84621RUQT
The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84621 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques. The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84621 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
-40 °C
85 °C
47-B1QFN (15x9)
47-BQFN Module
UVLO
2.8 mm
9 mm
0.11 in
0.35 "
0.59 "
15 mm
ITE (Commercial)
0.6 V
5.5 V
Surface Mount
4.5 V
Non-Isolated PoL Module
6 A
1
Active High, Enable

Description

General part information

TPS84621 Series

The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The TPS84621 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.