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YQ3RSM10SDTL1

YQ3RSM10SDTL1

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Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 3A, TO-277GE, HIGHLY EFFICIENT SBD

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YQ3RSM10SDTL1

YQ3RSM10SDTL1

Active
Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 3A, TO-277GE, HIGHLY EFFICIENT SBD

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Description

General part information

YQ3RSM10SD Series

The YQ3RSM10SD is a highly efficient Schottky Barrier Diode that is designed improving the tradeoff between low VFand low IR. While its low VFit achieves stable operation at high temperatures. Ideal for switching power supplies, freewheel diodes, and reverse polarity protection applications.

Technical Specifications

Parameters and characteristics for this part

SpecificationYQ3RSM10SDTL1
Current - Average Rectified (Io)3 A
Current - Reverse Leakage30 µA
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseTO-277, 3-PowerDFN
Package NameTO-277A
Speed - Fast Recovery (Maximum)500 ns
Speed - Fast Recovery (Minimum)200 mA
TechnologySchottky
Voltage - DC Reverse (Vr) (Max)100 V
Voltage - Forward (Vf) (Max)640 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Part Explanation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Impedance Characteristics of Bypass Capacitor
Notes for Temperature Measurement Using Thermocouples
Diode Types and Applications
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Moisture Sensitivity Level - Diodes
Compliance of the RoHS directive
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Use the Thermal Resistance and Thermal Characteristics Parameters
What is a Thermal Model? (Diode)
How to Select Rectifier Diodes
Diode Selection Method for Asynchronous Converter
What Is Thermal Design
How to Use LTspice&reg; Models
PCB Layout Thermal Design Guide
Basics of Thermal Resistance and Heat Dissipation
TO-277GE Dimensions
Absolute Maximum Rating and Electrical Characteristics of Diodes
Two-Resistor Model for Thermal Simulation
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
About Flammability of Materials
How to Select Reverse Current Protection Diodes for LDO Regulators
YQ3RSM10SD Data Sheet
How to Use LTspice&reg; Models: Tips for Improving Convergence
Judgment Criteria of Thermal Evaluation
List of Diode Package Thermal Resistance
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Importance of Probe Calibration When Measuring Power: Deskew
Anti-Whisker formation - Diodes
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Monitoring Switching Waveform
Notes for Calculating Power Consumption:Static Operation
About Export Regulations
Power Loss and Thermal Design of Diodes