
NX3020NAKW,115
ActiveNexperia USA Inc.
TRANS MOSFET N-CH 30V 0.18A 3-PIN SC-70 T/R

NX3020NAKW,115
ActiveNexperia USA Inc.
TRANS MOSFET N-CH 30V 0.18A 3-PIN SC-70 T/R
Description
General part information
NX3020NAKW Series
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | NX3020NAKW,115 |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 180 mA |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 2.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 0.44 nC |
| Input Capacitance (Ciss) (Max) | 13 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | SC-70, SOT-323 |
| Package Name | SOT-323 |
| Power Dissipation (Max) | 260 mW, 1.1 W |
| Rds On (Max) | 4.5 Ohm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 1.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Wave soldering profile
Nexperia package poster
RC Thermal Models
LFPAK MOSFET thermal design guide, Chinese version
plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body
Reflow soldering profile
Power MOSFET single-shot and repetitive avalanche ruggedness rating
plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body
Level shifting techniques in I2C-bus design
Questions about package outline drawings
Power MOSFET frequently asked questions and answers
Using power MOSFETs in parallel
LFPAK MOSFET thermal design guide - Part 2
Reel pack for SMD, 7"; Q3/T4 product orientation
Failure signature of Electrical Overstress on Power MOSFETs