74LVC1G38GN,132

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Nexperia USA Inc.

2-INPUT NAND GATE; OPEN DRAIN

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74LVC1G38GN,132

Active

Nexperia USA Inc.

2-INPUT NAND GATE; OPEN DRAIN

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Description Specifications Series Pricing CAD Documents

Description

General part information

74LVC1G38GN Series

The 74LVC1G38 is a single 2-input NAND gate with open-drain output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Technical Specifications

Parameters and characteristics for this part

Specification	74LVC1G38GN,132

Current - Output Low	32 mA
Current - Quiescent (Max)	4 µA
Features	Open Drain
Input Logic Level - High (Max)	2 V
Input Logic Level - High (Min)	1.7 V
Input Logic Level - Low (Max)	0.8 V
Input Logic Level - Low (Min)	0.7 V
Logic Type	NAND Gate
Max CL	50 pF
Max Propagation Delay	3.9 ns
Mounting Type	Surface Mount
Number of Circuits	1
Number of Inputs	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	6-XFDFN
Package Length	0.9 mm
Package Name	6-XSON
Package Width	1 mm
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	1.65 V

74LVC1G38GN Series

2-input NAND gate; open drain

Part	Logic Type	Number of Inputs	Current - Quiescent (Max)	Mounting Type	Number of Circuits	Max Propagation Delay	Max CL	Current - Output Low	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Input Logic Level - High (Min)	Input Logic Level - High (Max)	Input Logic Level - Low (Max)	Input Logic Level - Low (Min)	Operating Temperature (Max)	Operating Temperature (Min)	Package / Case	Package Length	Package Name	Package Width	Features
Nexperia USA Inc. 74LVC1G38GN,132	NAND Gate	2	4 µA	Surface Mount	1	3.9 ns	50 pF	32 mA	1.65 V	5.5 V	1.7 V	2 V	0.8 V	0.7 V	125 °C	-40 °C	6-XFDFN	0.9 mm	6-XSON	1 mm	Open Drain

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Reflow soldering profile

XSON6; Reel pack for SMD, 7''; Q3/T4 product orientation

Questions about package outline drawings

Pin FMEA for LVC family

MicroPak leadless logic portfolio guide

plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body

Nexperia package poster

MAR_SOT1115 Topmark

plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body

74LVC1G38GN Nexperia Product Reliability