
PMXB56ENZ
ActiveNexperia USA Inc.
MOSFET N-CH 30V 3.2A DFN1010D-3

PMXB56ENZ
ActiveNexperia USA Inc.
MOSFET N-CH 30V 3.2A DFN1010D-3
Description
General part information
PMXB56EN Series
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMXB56ENZ |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 3.2 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 6.3 nC |
| Input Capacitance (Ciss) (Max) | 209 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 3-XDFN Exposed Pad |
| Package Name | DFN1010D-3 |
| Power Dissipation (Max) | 8.33 W, 400 mW |
| Rds On (Max) | 55 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Nexperia package poster
LFPAK MOSFET thermal design guide - Part 2
Power MOSFET frequently asked questions and answers
High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages
适合移动和便携式设备的 大批量小信号MOSFET, 采用WLCSP和无引脚DFN封装
Thermal performance of DFN packages
Questions about package outline drawings
DFN1010D-3; Reel pack, SMD, 7"; Q2/T3 standard product orientation; Orderable part number ending ,147 or Z; Ordering code (12NC) ending 147
Using power MOSFETs in parallel
RC Thermal Models
Reflow soldering profile
LFPAK MOSFET thermal design guide, Chinese version
plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Power MOSFET single-shot and repetitive avalanche ruggedness rating