Specification	HSM360Ge3/TR13

Current - Average Rectified (Io)	3 A
Current - Reverse Leakage	100 µA
Mounting Type	Surface Mount
Operating Temperature - Junction (Max)	175 °C
Operating Temperature - Junction (Min)	-55 °C
Package / Case	DO-215AB, SMC Gull Wing
Package Name	DO-215AB
Speed - Fast Recovery (Maximum)	500 ns
Speed - Fast Recovery (Minimum)	200 mA
Technology	Schottky
Voltage - DC Reverse (Vr) (Max)	60 V
Voltage - Forward (Vf) (Max)	620 mV

HSM360 Series

Part	Current - Average Rectified (Io)	Current - Reverse Leakage	Operating Temperature - Junction (Max)	Operating Temperature - Junction (Min)	Technology	Mounting Type	Speed - Fast Recovery (Maximum)	Speed - Fast Recovery (Minimum)	Voltage - Forward (Vf) (Max)	Voltage - DC Reverse (Vr) (Max)	Package / Case	Package Name
Microchip Technology HSM360J/TR13	3 A	100 µA	175 °C	-55 °C	Schottky	Surface Mount	500 ns	200 mA	620 mV	60 V	DO-214AB SMC	DO-214AB
Microchip Technology HSM360G/TR13	3 A	100 µA	175 °C	-55 °C	Schottky	Surface Mount	500 ns	200 mA	620 mV	60 V	DO-215AB SMC Gull Wing	DO-215AB
Microchip Technology HSM360Ge3/TR13	3 A	100 µA	175 °C	-55 °C	Schottky	Surface Mount	500 ns	200 mA	620 mV	60 V	DO-215AB SMC Gull Wing	DO-215AB
Microchip Technology HSM360JE3/TR13	3 A	100 µA	175 °C	-55 °C	Schottky	Surface Mount	500 ns	200 mA	620 mV	60 V	DO-214AB SMC	DO-214AB

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