
BR25H640NUX-5ACTR
ActiveRohm Semiconductor
64KBIT, SPI BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)

BR25H640NUX-5ACTR
ActiveRohm Semiconductor
64KBIT, SPI BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
Description
General part information
BR25H640NUX-5AC Series
BR25H640xxx-5AC Series is a 64 kbit serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25H640NUX-5ACTR |
|---|---|
| Clock Frequency | 20 MHz |
| Grade | Automotive |
| Memory Depth | 8 K |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 8 KB |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 8-UFDFN Exposed Pad |
| Package Name | VSON008X2030 |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
What Is Thermal Design
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Five Steps for Successful Thermal Design of IC
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Opcode, Address, and Page Configuration for SPI BUS EEPROM
Factory Information
Basics of Thermal Resistance and Heat Dissipation
Solder Joint Rate and Thermal Resistance of Exposed Pad
VSON008X2030 Package Information
Impedance Characteristics of Bypass Capacitor
Design Guide and Example of Stencil for Exposed Pad
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Thermal Resistance