PMCXB290UEZ

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Nexperia USA Inc.

20 V, COMPLEMENTARY N/P-CHANNEL TRENCH MOSFET

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PMCXB290UEZ

Active

Nexperia USA Inc.

20 V, COMPLEMENTARY N/P-CHANNEL TRENCH MOSFET

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Description Specifications Series Pricing CAD Documents

Description

General part information

PMCXB290UE Series

Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Technical Specifications

Parameters and characteristics for this part

Specification	PMCXB290UEZ

Configuration	P-Channel Complementary, N
Current - Continuous Drain (Id) (Ta)	930 mA
Current - Continuous Drain (Id) (Ta) (2)	570 mA
Current - Continuous Drain (Id) (Tc)	3.5 A
Current - Continuous Drain (Id) (Tc) (2)	2.3 A
Drain to Source Voltage (Vdss)	20 V
Gate Charge (Max)	0.9 nC
Input Capacitance (Ciss) (Max)	53.5 pF, 43.6 pF
Mounting Type	Surface Mount
Operating Temperature (Max)	150 °C
Operating Temperature (Min)	-55 °C
Package / Case	6-XFDFN Exposed Pad
Package Name	DFN1010B-6
Power - Max (Ta)	280 mW
Power - Max (Tc)	6 W
Rds On (Max)	770 mOhm, 320 mOhm
Technology	MOSFET (Metal Oxide)
Vgs(th) (Max)	1 V

PMCXB290UE Series

20 V, complementary N/P-channel Trench MOSFET

Part	Configuration	Mounting Type	Input Capacitance (Ciss) (Max)	Operating Temperature (Min)	Operating Temperature (Max)	Power - Max (Tc)	Power - Max (Ta)	Gate Charge (Max)	Drain to Source Voltage (Vdss)	Vgs(th) (Max)	Technology	Rds On (Max)	Package / Case	Current - Continuous Drain (Id) (Tc) (2)	Current - Continuous Drain (Id) (Tc)	Current - Continuous Drain (Id) (Ta)	Current - Continuous Drain (Id) (Ta) (2)	Package Name
Nexperia USA Inc. PMCXB290UEZ	N P-Channel Complementary	Surface Mount	43.6 pF 53.5 pF	-55 °C	150 °C	6 W	280 mW	0.9 nC	20 V	1 V	MOSFET (Metal Oxide)	320 mOhm 770 mOhm	6-XFDFN Exposed Pad	2.3 A	3.5 A	930 mA	570 mA	DFN1010B-6

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

DFN1010B-6; Reel pack for SMD, 7''; Q2/T3 product orientation

Low temperature soldering, application study

Nexperia package poster

Thermal performance of DFN packages

plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body

Questions about package outline drawings

Reflow soldering profile

plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.35 mm pitch; 1.1 mm x 1 mm x 0.37 mm body