510-83-085-13-001101

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Preci-Dip

CONN SOCKET PGA 85POS GOLD

510-83-085-13-001101

Active

Preci-Dip

CONN SOCKET PGA 85POS GOLD

Description Specifications Series Pricing CAD Documents

Description

General part information

510-83 Series

85 (13 x 13) Pos PGA Socket Gold Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	510-83-085-13-001101

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	29.5 Ąin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Contact Resistance	10 mOhm
Current Rating	1 A
Features	Open Frame
Grid Columns	13
Grid Rows	13
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	85
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.125 in
Type	PGA

510-83 Series

...

Part	Pitch - Post	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Type	Pitch - Mating	Features	Housing Material	Mounting Type	Termination	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Material - Mating	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Termination Post Length	Contact Resistance	Material Flammability Rating	Current Rating
Preci-Dip 510-83-273-21-121101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	273	21	21	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-175-16-071101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	175 count	16	16	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-176-16-071101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	176	16	16	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-209-17-062101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	209	17	17	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-124-13-041101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	124	13	13	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-160-13-001101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	160	13	13	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-133-14-071101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	133	14	14	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-085-13-001101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	85	13	13	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-044-08-031101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	44	8	8	0.125 in	10 mOhm	UL94 V-0	1 A
Preci-Dip 510-83-180-15-002101	0.1 in	Gold	125 °C	-55 °C	PGA	0.1 in	Open Frame	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Through Hole	Solder	Brass	Tin	29.5 Ąin	Beryllium Copper	180 count	15	15	0.125 in	10 mOhm	UL94 V-0	1 A

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