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TN0104N8-G - SOT-89 / 3

TN0104N8-G

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Microchip Technology

POWER MOSFET, N CHANNEL, 40 V, 630 MA, 2 OHM, TO-243AA, SURFACE MOUNT

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TN0104N8-G - SOT-89 / 3

TN0104N8-G

Active
Microchip Technology

POWER MOSFET, N CHANNEL, 40 V, 630 MA, 2 OHM, TO-243AA, SURFACE MOUNT

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTN0104N8-GTN0104 Series
Current - Continuous Drain (Id) @ 25°C-450 mA
Drain to Source Voltage (Vdss)-40 V
Drive Voltage (Max Rds On, Min Rds On)-3 - 10 V
FET Type-N-Channel
Input Capacitance (Ciss) (Max) @ Vds-70 pF
Mounting Type-Through Hole
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-226-3, TO-92-3
Power Dissipation (Max)-1 W
Rds On (Max) @ Id, Vgs-1.8 Ohm
Supplier Device Package-TO-92-3
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-1.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Microchip DirectT/R 1$ 1.43
25$ 1.17
100$ 1.09
1000$ 0.90
5000$ 0.83
10000$ 0.77

TN0104 Series

40V, 1.8 Ohm, N-Channel, Enhancement-Mode, Vertical DMOS FET

PartPower Dissipation (Max)Drive Voltage (Max Rds On, Min Rds On)Input Capacitance (Ciss) (Max) @ VdsVgs(th) (Max) @ IdOperating Temperature [Min]Operating Temperature [Max]Vgs (Max)FET TypeMounting TypeDrain to Source Voltage (Vdss)Rds On (Max) @ Id, VgsPackage / CaseSupplier Device PackageTechnologyCurrent - Continuous Drain (Id) @ 25°C
Microchip Technology
TN0104N3-G-P014
1 W
3 V, 10 V
70 pF
1.6 V
-55 °C
150 °C
20 V
N-Channel
Through Hole
40 V
1.8 Ohm
TO-226-3, TO-92-3
TO-92-3
MOSFET (Metal Oxide)
450 mA
Microchip Technology
TN0104N3-G-P003
1 W
3 V, 10 V
70 pF
1.6 V
-55 °C
150 °C
20 V
N-Channel
Through Hole
40 V
1.8 Ohm
TO-226-3, TO-92-3
TO-92-3
MOSFET (Metal Oxide)
450 mA
Microchip Technology
TN0104N8-G
Microchip Technology
TN0104N3-G-P014
Microchip Technology
TN0104N3-G-P003

Description

General part information

TN0104 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.