04-0518-11H

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Aries Electronics

CONN SOCKET SIP 4POS GOLD

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Aries Electronics

CONN SOCKET SIP 4POS GOLD

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	04-0518-11H	04-0518 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold, Tin
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	10 çin	10 - 200 çin
Contact Finish Thickness - Post	0.25 çm	0.25 - 5.08 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Surface Mount
Number of Positions or Pins (Grid)	4	4
Number of Positions or Pins (Grid) [custom]	1 x 4	1 x 4
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Termination Post Length	-	0.046 in
Termination Post Length	-	1.17 mm
Type	SIP	SIP

CONN SOCKET SIP 4POS GOLD

Part	Contact Finish - Post	Type	Termination	Mounting Type	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Features	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 04-0518-11	Gold	SIP	Solder	Through Hole	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Beryllium Copper	UL94 V-0	3.18 mm	0.125 in	2.54 mm	0.1 in	Brass	4	1 x 4	10 çin	0.25 çm	10 çin	0.25 çm	Gold	Open Frame	3 A
Aries Electronics 04-0518-10H	Tin	SIP	Solder	Through Hole	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Beryllium Copper	UL94 V-0	3.18 mm	0.125 in	2.54 mm	0.1 in	Brass	4	1 x 4	10 çin	0.25 çm	200 µin	5.08 µm	Gold	Open Frame	3 A
Aries Electronics 04-0518-11H	Gold	SIP	Solder	Through Hole	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Beryllium Copper	UL94 V-0	3.18 mm	0.125 in	2.54 mm	0.1 in	Brass	4	1 x 4	10 çin	0.25 çm	10 çin	0.25 çm	Gold	Open Frame	3 A
Aries Electronics 04-0518-00	Tin	SIP	Solder	Surface Mount	Glass Filled, Nylon 4/6, Polyamide (PA46)	0.1 in	2.54 mm	Beryllium Copper	UL94 V-0			2.54 mm	0.1 in	Brass	4	1 x 4	10 çin	0.25 çm	200 µin	5.08 µm	Gold	Open Frame	3 A	0.046 in	1.17 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	463	$ 0.95

General part information

4 (1 x 4) Pos SIP Socket Gold Through Hole

Technical documentation and resources