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RGPR30NS40HRTL

RGPR30NS40HRTL

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Rohm Semiconductor

IGBT, 30 A, 1.6 V, 125 W, 430 V, TO-263 (D2PAK), 3 PINS

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RGPR30NS40HRTL

RGPR30NS40HRTL

Active
Rohm Semiconductor

IGBT, 30 A, 1.6 V, 125 W, 430 V, TO-263 (D2PAK), 3 PINS

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Description

General part information

RGPR30NS40HR Series

RGPR30NS40 is a Ignition IGBT with low collector - emitter saturation voltage, suitable for Ignition Coil Driver Circuits, Solenoid Driver Circuits. It is a highly reliable product for automotive.

Technical Specifications

Parameters and characteristics for this part

SpecificationRGPR30NS40HRTL
Current - Collector (Ic) (Max)30 A
Gate Charge22 nC
GradeAutomotive
Input TypeStandard
Mounting TypeSurface Mount
Operating Temperature (Max)175 °C
Operating Temperature (Min)-40 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Package NameLPDS
Power - Max125 W
QualificationAEC-Q101
Td (off) @ 25°C4 µs
Td (on) @ 25°C500 ns
Test Condition Current8 A
Test Condition Resistance100 Ohm
Test Condition Voltage300 V
Test Condition Voltage (Secondary)5 V
Vce(on) (Max)2 V
Voltage - Collector Emitter Breakdown (Max)430 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Anti-Whisker formation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Monitoring Switching Waveform
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
Package Dimensions
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Notes for Temperature Measurement Using Thermocouples
Part Explanation
Types and Features of Transistors
Estimation of switching losses in IGBTs operating with resistive load
Importance of Probe Calibration When Measuring Power: Deskew
Judgment Criteria of Thermal Evaluation
Measurement Method and Usage of Thermal Resistance RthJC
Notes for Calculating Power Consumption:Static Operation
Basics of Thermal Resistance and Heat Dissipation
Impedance Characteristics of Bypass Capacitor
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
How to Use LTspice® Models: Tips for Improving Convergence
About Flammability of Materials
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
What Is Thermal Design
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Compliance of the ELV directive
How to Use LTspice&reg; Models
Precautions for Thermal Resistance of Insulation Sheet
4 Steps for Successful Thermal Designing of Power Devices
Moisture Sensitivity Level
About Export Administration Regulations (EAR)
How to Create Symbols for PSpice Models
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Two-Resistor Model for Thermal Simulation
Calculation of Power Dissipation in Switching Circuit
Precautions When Measuring the Rear of the Package with a Thermocouple
What is a Thermal Model? (IGBT)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
θ<sub>JA</sub> and Ψ<sub>JT</sub>
PCB Layout Thermal Design Guide