
RGPR30NS40HRTL
ActiveRohm Semiconductor
IGBT, 30 A, 1.6 V, 125 W, 430 V, TO-263 (D2PAK), 3 PINS

RGPR30NS40HRTL
ActiveRohm Semiconductor
IGBT, 30 A, 1.6 V, 125 W, 430 V, TO-263 (D2PAK), 3 PINS
Description
General part information
RGPR30NS40HR Series
RGPR30NS40 is a Ignition IGBT with low collector - emitter saturation voltage, suitable for Ignition Coil Driver Circuits, Solenoid Driver Circuits. It is a highly reliable product for automotive.
Technical Specifications
Parameters and characteristics for this part
| Specification | RGPR30NS40HRTL |
|---|---|
| Current - Collector (Ic) (Max) | 30 A |
| Gate Charge | 22 nC |
| Grade | Automotive |
| Input Type | Standard |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | D2PAK (2 Leads + Tab), TO-263-3, TO-263AB |
| Package Name | LPDS |
| Power - Max | 125 W |
| Qualification | AEC-Q101 |
| Td (off) @ 25°C | 4 µs |
| Td (on) @ 25°C | 500 ns |
| Test Condition Current | 8 A |
| Test Condition Resistance | 100 Ohm |
| Test Condition Voltage | 300 V |
| Test Condition Voltage (Secondary) | 5 V |
| Vce(on) (Max) | 2 V |
| Voltage - Collector Emitter Breakdown (Max) | 430 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Anti-Whisker formation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Method for Monitoring Switching Waveform
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
Package Dimensions
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Notes for Temperature Measurement Using Thermocouples
Part Explanation
Types and Features of Transistors
Estimation of switching losses in IGBTs operating with resistive load
Importance of Probe Calibration When Measuring Power: Deskew
Judgment Criteria of Thermal Evaluation
Measurement Method and Usage of Thermal Resistance RthJC
Notes for Calculating Power Consumption:Static Operation
Basics of Thermal Resistance and Heat Dissipation
Impedance Characteristics of Bypass Capacitor
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
How to Use LTspice® Models: Tips for Improving Convergence
About Flammability of Materials
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
What Is Thermal Design
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Compliance of the ELV directive
How to Use LTspice® Models
Precautions for Thermal Resistance of Insulation Sheet
4 Steps for Successful Thermal Designing of Power Devices
Moisture Sensitivity Level
About Export Administration Regulations (EAR)
How to Create Symbols for PSpice Models
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Two-Resistor Model for Thermal Simulation
Calculation of Power Dissipation in Switching Circuit
Precautions When Measuring the Rear of the Package with a Thermocouple
What is a Thermal Model? (IGBT)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
θ<sub>JA</sub> and Ψ<sub>JT</sub>
PCB Layout Thermal Design Guide