
VSC8541XMV-05
Active1 PORT GBE CU PHY WITH SYNCE, (R/G/RG)MII (IND. TEMP) 68 VQFN 8X8X0.9MM TRAY ROHS COMPLIANT: YES
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VSC8541XMV-05
Active1 PORT GBE CU PHY WITH SYNCE, (R/G/RG)MII (IND. TEMP) 68 VQFN 8X8X0.9MM TRAY ROHS COMPLIANT: YES
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Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | VSC8541XMV-05 | VSC8541 Series |
---|---|---|
- | - | |
Function | Ethernet | Ethernet |
Interface | MII, RMII, GMII | RMII, MII, GMII |
Mounting Type | Surface Mount | Surface Mount |
Number of Circuits | 1 | 1 |
Operating Temperature [Max] | 125 °C | 125 °C |
Operating Temperature [Min] | -40 °C | -40 - 0 °C |
Package / Case | 68-VFQFN Exposed Pad | 68-VFQFN Exposed Pad |
Supplier Device Package | 68-QFN (8x8) | 68-QFN (8x8) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
Digikey | Tray | 1 | $ 7.17 | |
25 | $ 5.97 | |||
100 | $ 5.78 | |||
Microchip Direct | TRAY | 1 | $ 7.17 | |
25 | $ 5.97 | |||
100 | $ 5.43 | |||
1000 | $ 5.03 | |||
5000 | $ 4.76 | |||
Newark | Each | 100 | $ 5.43 |
VSC8541 Series
IC TELECOM INTERFACE 68QFN
Part | Supplier Device Package | Package / Case | Interface | Number of Circuits | Function | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] |
---|---|---|---|---|---|---|---|---|
Microchip Technology VSC8541XMV-01 | 68-QFN (8x8) | 68-VFQFN Exposed Pad | RMII | 1 | Ethernet | Surface Mount | 0 °C | 125 °C |
Microchip Technology VSC8541XMV-02 | 68-QFN (8x8) | 68-VFQFN Exposed Pad | GMII, MII, RMII | 1 | Ethernet | Surface Mount | 0 °C | 125 °C |
Microchip Technology VSC8541XMV-05 | ||||||||
Microchip Technology VSC8541XMV-05 | 68-QFN (8x8) | 68-VFQFN Exposed Pad | GMII, MII, RMII | 1 | Ethernet | Surface Mount | -40 °C | 125 °C |
Description
General part information
VSC8541 Series
Low-power, small form-factor Cu PHY with IEEE 802.3az Energy Efficient Ethernet (EEE), Wake-on-LAN (WoL), Synchronous Ethernet (SyncE), Start of Frame (SOF), and Fast Link Failure 2.0 (FLF2) indication, with widest I/O LVCMOS support. The VSC8541 device, offered in a small 8 mm x 8 mm single-row QFN package, is designed for space-constrained 10/100/1000BASE-T applications. It features integrated line-side termination to conserve board space, lower EMI, and improve system performance. Additionally, integrated RGMII version 2.0 standard timing compliant compensation eliminates the need for on-board delay lines.
The device supports the industry’s widest range of LVCMOS levels for a parallel MAC interface including: 1.5 V, 1.8 V, 2.5 V, and 3.3 V, as well as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V support on the MDIO/MDC interface. It includes Microchip’s EcoEthernet™ 2.0 technology with Energy Efficient Ethernet and power saving features to reduce power based on link state and cable reach. It optimizes power consumption at all link operating speeds, and features Wake-on-LAN power management using magic packets. The device has a recovered clock output for Synchronous Ethernet applications. Programmable clock squelch control is included to inhibit undesirable clocks from propagating and to help prevent timing loops. Microchip's patented Ring Resiliency™ allows a PHY port to switch between master and slave timing references with no link drop while in 1000BASE-T mode. VSC8541 also includes Fast Link Failure (FLF) indication for high availability networks. FLF indication identifies the onset of a link failure in less than 1 ms typical, which goes beyond the IEEE 802.3 standard requirement of 750 ms ±10 ms (link master). In addition, the device adds a programmable threshold for applications where indication of even a potential link drop must be known at the microsecond level (<10 μs).
Microchip's complimentary and confidential [MicroCHECK](https://www.microchip.com/en-us/support/design-help/design-check-services) design review service, which offers insight from the initial concept to the final PCB layout, is available to customers who are using our products in their projects. You can confidently submit your design materials in a secure and private setting, and our expert engineers will provide individualized feedback to enhance your design. MicroCHECK design review service is subject to Microchip's [Program Terms and Conditions](https://www.microchip.com/en-us/support/design-help/design-check-services/design-check-services-program-terms-and-conditions) and requires a myMicrochip account.
Documents
Technical documentation and resources