Specification	LPC5528JBD64Y

A/D Channels	10 count
A/D Resolution (bits)	16 bit
Connectivity	USB, SPI, I2C, USART, UART, SD, Flexcomm, SDIO, MMC
Core Processor	ARM® Cortex®-M33
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	36
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal, External
Package / Case	64-TQFP Exposed Pad
Package Length	10 mm
Package Name	64-HTQFP
Package Width	10 mm
Peripherals	POR, PWM, DMA, I2S, Reset, WDT, RNG, Brown-out Detect
Program Memory Depth	512 K
Program Memory Size	512 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	256 K
RAM Size Width	8 bit
Speed	150 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.8 V

LPC552x Series

Part	Number of I/O	Connectivity	Package Name	Package Width	Package Length	Core Size (Bit Width)	Program Memory Width	Program Memory Size	Program Memory Depth	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	A/D Channels	Converter Architecture	A/D Resolution (bits)	Oscillator Type	Package / Case	Core Processor	RAM Size Depth	RAM Size Width	Operating Temperature (Max)	Operating Temperature (Min)	Peripherals	Program Memory Type	Speed	Mounting Type
NXP USA Inc. LPC5528JEV59Y	37	Flexcomm I2C MMC SD SDIO SPI UART USART USB	59-VFBGA	4 mm	4 mm	32 Bit	8 bit	512 KB	512 K	3.6 V	1.8 V	10 count	SAR	16 bit	External Internal	59-VFBGA	ARM® Cortex®-M33F	256 K	8 bit	105 °C	-40 °C	AES Brown-out Detect DMA I2S POR PWM Reset TRNG WDT	FLASH	150 MHz	Surface Mount
NXP USA Inc. LPC5528JBD64Y	36	Flexcomm I2C MMC SD SDIO SPI UART USART USB	64-HTQFP	10 mm	10 mm	32 Bit	8 bit	512 KB	512 K	3.6 V	1.8 V	10 count		16 bit	External Internal	64-TQFP Exposed Pad	ARM® Cortex®-M33	256 K	8 bit	105 °C	-40 °C	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	FLASH	150 MHz	Surface Mount

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