
SM671PAC-BFSS
ActiveSilicon Motion, Inc.
IC FLASH 160GBIT UFS3.1 153BGA
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SM671PAC-BFSS
ActiveSilicon Motion, Inc.
IC FLASH 160GBIT UFS3.1 153BGA
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SM671PAC-BFSS |
|---|---|
| Memory Format | FLASH |
| Memory Interface | UFS3.1 |
| Memory Size | 160 Mbit |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 153-TBGA |
| Supplier Device Package | 153-BGA |
| Supplier Device Package [x] | 11.5 |
| Supplier Device Package [y] | 13 |
| Technology | FLASH - NAND (SLC) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 32.20 | |
Description
General part information
SM671 Series
FLASH - NAND (SLC) Memory IC 160Gbit UFS3.1 153-BGA (11.5x13)
Documents
Technical documentation and resources