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153-BGA

SM671PAC-BFSS

Active
Silicon Motion, Inc.

IC FLASH 160GBIT UFS3.1 153BGA

153-BGA

SM671PAC-BFSS

Active
Silicon Motion, Inc.

IC FLASH 160GBIT UFS3.1 153BGA

Description

General part information

SM671 Series

FLASH - NAND (SLC) Memory IC 160Gbit UFS3.1 153-BGA (11.5x13)

Technical Specifications

Parameters and characteristics for this part

SpecificationSM671PAC-BFSS
Memory Depth20 G
Memory FormatFLASH
Memory Interface (Type)UFS3.1
Memory Size20 GB
Memory TypeNon-Volatile
Memory Width8 bit
Mounting TypeSurface Mount
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Package / Case153-TBGA
Package Length11.5 mm
Package Name153-BGA
Package Width13 mm
TechnologyFLASH - NAND (SLC)

Pricing

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