Specification	XC2S200E-6FG456C

Mounting Type	Surface Mount
Number of Gates	200000
Number of I/O	289
Number of LABs/CLBs	1176
Number of Logic Elements/Cells	5292
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	0 °C
Package / Case	456-BBGA
Package Length	23 mm
Package Name	456-FBGA
Package Width	23 mm
Total RAM Bits	57344 bits
Voltage - Supply (Maximum)	1.89 V
Voltage - Supply (Minimum)	1.71 V

XC2S200E Series

Part	Mounting Type	Package / Case	Number of LABs/CLBs	Total RAM Bits	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Package Width	Package Name	Package Length	Number of Logic Elements/Cells	Number of Gates	Number of I/O	Operating Temperature (Max)
AMD / Xilinx XC2S200E-6FG456C	Surface Mount	456-BBGA	1176	57344 bits	1.89 V	1.71 V	23 mm	456-FBGA	23 mm	5292	200000	289	85 °C
AMD / Xilinx XC2S200E-6PQ208C	Surface Mount	208-BFQFP	1176	57344 bits	1.89 V	1.71 V	28 mm	208-PQFP	28 mm	5292	200000	146	85 °C
AMD / Xilinx XC2S200E-6FGG456C	Surface Mount	456-BBGA	1176	57344 bits	1.89 V	1.71 V	23 mm	456-FBGA	23 mm	5292	200000	289	85 °C

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