T2M-108-01-L-D-SM-WT-TR

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Samtec Inc.

CONN HEADER SMD 16POS 2MM

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T2M-108-01-L-D-SM-WT-TR

Active

Samtec Inc.

CONN HEADER SMD 16POS 2MM

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	T2M-108-01-L-D-SM-WT-TR

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3.8 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	5.8 mm
Insulation Height	0.228 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder

T2M-108 Series

Part	Pitch - Mating [x]	Pitch - Mating [x]	Features	Fastening Type	Current Rating (Amps)	Number of Positions Loaded	Row Spacing - Mating	Row Spacing - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Style	Insulation Material	Contact Type	Contact Finish - Post	Number of Positions	Termination	Mounting Type	Number of Rows	Insulation Height	Insulation Height	Insulation Color	Contact Material	Contact Shape	Shrouding	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Length - Post	Contact Length - Post	Insulation Height [z]	Insulation Height [z]	Overall Contact Length	Overall Contact Length
Samtec Inc. T2M-108-01-L-D-SM-WT-TR	0.079 in	2 mm	Solder Retention	Push-Pull	3.8 A	All	0.079 in	2 mm	-55 °C	125 °C	Header	Board to Board Cable	Liquid Crystal Polymer (LCP)	Male Pin	Tin	16	Solder	Surface Mount	2	5.8 mm	0.228 in	Black	Phosphor Bronze	Square	Shrouded - 4 Wall	10 çin	0.25 çm	Gold
Samtec Inc. T2M-108-01-L-D-SM-WT-K-TR	0.079 in	2 mm	Pick and Place Solder Retention	Push-Pull	3.8 A	All	0.079 in	2 mm	-55 °C	125 °C	Header	Board to Board Cable	Liquid Crystal Polymer (LCP)	Male Pin	Tin	16	Solder	Surface Mount	2	5.8 mm	0.228 in	Black	Phosphor Bronze	Square	Shrouded - 4 Wall	10 çin	0.25 çm	Gold
Samtec Inc. T2M-108-01-L-D-SM-WT	0.079 in	2 mm	Solder Retention	Push-Pull	3.8 A	All	0.079 in	2 mm	-55 °C	125 °C	Header	Board to Board Cable	Liquid Crystal Polymer (LCP)	Male Pin	Tin	16	Solder	Surface Mount	2	5.8 mm	0.228 in	Black	Phosphor Bronze	Square	Shrouded - 4 Wall	10 çin	0.25 çm	Gold
Samtec Inc. T2M-108-01-L-D-RA	0.079 in	2 mm		Push-Pull	3.8 A	All	0.079 in	2 mm	-55 °C	125 °C	Header	Board to Board Cable	Liquid Crystal Polymer (LCP)	Male Pin	Tin	16	Solder	Through Hole Right Angle	2			Black	Phosphor Bronze	Square	Shrouded - 4 Wall	10 çin	0.25 çm	Gold	0.09 "	2.29 mm	7.44 mm	0.293 in
Samtec Inc. T2M-108-01-L-D-TH-WT	0.079 in	2 mm	Solder Retention	Push-Pull	3.8 A	All	0.079 in	2 mm	-55 °C	125 °C	Header	Board to Board Cable	Liquid Crystal Polymer (LCP)	Male Pin	Tin	16	Solder	Through Hole	2	5.8 mm	0.228 in	Black	Phosphor Bronze	Square	Shrouded - 4 Wall	10 çin	0.25 çm	Gold	0.117 in	2.97 mm			0.302 in	7.67 mm
Samtec Inc. T2M-108-01-S-D-TH-WT	0.079 in	2 mm	Solder Retention	Push-Pull	3.8 A	All	0.079 in	2 mm	-55 °C	125 °C	Header	Board to Board Cable	Liquid Crystal Polymer (LCP)	Male Pin	Tin	16	Solder	Through Hole	2	5.8 mm	0.228 in	Black	Phosphor Bronze	Square	Shrouded - 4 Wall	30 Áin	0.76 Ám	Gold	0.117 in	2.97 mm			0.302 in	7.67 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	500	$ 3.04

Description

General part information

T2M-108 Series

Connector Header Surface Mount 16 position 0.079" (2.00mm)

Documents

Technical documentation and resources

No documents available