Specification	25-7080-0069

Composition Elements	Sb, Sn
Composition Formula	Sn95Sb5
Diameter	0.125 in
Flux Type	Rosin Activated (RA)
Form	Spool
Form Weight	4 lbs
Melting Point (Max)	464 °F
Melting Point (Min)	450 °F
Process	Lead Free
Sb Composition	5 %
Sn Composition	95 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	8 AWG, 10 SWG

25-7080 Series

Part	Type	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Composition Elements	Composition Formula	Sb Composition	Sn Composition	Wire Gauge	Flux Type	Process	Melting Point (Max)	Melting Point (Min)	Diameter	Form	Form Weight
Kester Solder 25-7080-0069	Wire Solder	50 °F	104 °F	Sb Sn	Sn95Sb5	5 %	95 %	10 SWG 8 AWG	Rosin Activated (RA)	Lead Free	464 °F	450 °F	0.125 in	Spool	4 lbs

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