Specification	2147210100

Applications	General Purpose, Telecommunications
Connector Type	Header
Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	39.4 µin
Contact Finish Thickness - Post	39.4 µin
Contact Material	Copper Alloy
Contact Type	Forked
Current Rating	1 A
Fastening Type	Detent Lock
Features	Solder Retention
Insulation Color	Black
Insulation Height	0.063 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Right Angle, Surface Mount
Number of Positions	10
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Pitch - Mating	0.031 in
Style	Cable/Wire, Board
Termination	Solder
Voltage Rating	30 V

214721 Series

Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Friction Lock, 15 Circuits, Tape and Reel

Part	Contact Finish - Mating	Contact Type	Contact Finish - Post	Connector Type	Voltage Rating	Style	Mounting Type	Material Flammability Rating	Number of Positions	Number of Rows	Features	Insulation Height	Pitch - Mating	Number of Positions Loaded	Contact Finish Thickness - Mating	Insulation Color	Fastening Type	Termination	Current Rating	Operating Temperature (Min)	Operating Temperature (Max)	Current Rating	Contact Material	Contact Shape	Voltage Rating (Type)	Shrouding	Insulation Material	Applications	Contact Finish Thickness - Post
Molex 2147210040	Tin	Forked	Tin	Header	30 V	Board Cable/Wire	Right Angle Surface Mount	UL94 V-0	4	1	Solder Retention	0.063 in	0.031 in	All	39.4 µin	Black	Detent Lock	Solder	1.5 A	-40 °C	85 °C
Molex 2147210191	Gold	Male Pin	Gold	Header	30 V	Board	Right Angle Surface Mount	UL94 V-0	19	1	Solder Retention	0.063 in	0.031 in	All	3.94 µin	Black	Push-Pull	Solder	0 A	-40 °C	105 °C	Varies by Wire Gauge	Copper Alloy	Square	AC DC	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)
Molex 2147210051	Gold	Male Pin	Gold	Header	30 V	Board	Right Angle Surface Mount	UL94 V-0	5	1	Solder Retention	0.063 in	0.031 in	All	3.94 µin	Black	Push-Pull	Solder	0 A	-40 °C	105 °C	Varies by Wire Gauge	Copper Alloy	Square	AC DC	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)
Molex 2147210030	Tin	Forked	Tin	Header	30 V	Board Cable/Wire	Right Angle Surface Mount	UL94 V-0	3	1	Solder Retention	0.063 in	0.031 in	All	39.4 µin	Black	Detent Lock	Solder	1.5 A	-40 °C	85 °C		Copper Alloy				Liquid Crystal Polymer (LCP)	General Purpose Telecommunications	39.4 µin
Molex 2147210200	Tin	Forked	Tin	Header	30 V	Board Cable/Wire	Right Angle Surface Mount	UL94 V-0	20	1	Solder Retention	0.063 in	0.031 in	All	39.4 µin	Black	Detent Lock	Solder	1 A	-40 °C	85 °C		Copper Alloy				Liquid Crystal Polymer (LCP)	General Purpose Telecommunications	39.4 µin
Molex 2147210101	Gold	Forked	Gold	Header	30 V	Board Cable/Wire	Right Angle Surface Mount	UL94 V-0	10	1	Solder Retention	0.063 in	0.031 in	All	3.94 µin	Black	Push-Pull	Solder	0 A	-40 °C	105 °C	Varies by Wire Gauge			AC DC
Molex 2147210031	Gold	Male Pin	Gold	Header	30 V	Board	Right Angle Surface Mount	UL94 V-0	3	1	Solder Retention	0.063 in	0.031 in	All	3.94 µin	Black	Push-Pull	Solder	0 A	-40 °C	105 °C	Varies by Wire Gauge	Copper Alloy	Square	AC DC	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)
Molex 2147210170	Tin	Forked	Tin	Header	30 V	Board Cable/Wire	Right Angle Surface Mount	UL94 V-0	17	1	Solder Retention	0.063 in	0.031 in	All	39.4 µin	Black	Detent Lock	Solder	1 A	-40 °C	85 °C		Copper Alloy				Liquid Crystal Polymer (LCP)	General Purpose Telecommunications	39.4 µin
Molex 2147210070	Tin	Forked	Tin	Header	30 V	Board Cable/Wire	Right Angle Surface Mount	UL94 V-0	7	1	Solder Retention	0.063 in	0.031 in	All	39.4 µin	Black	Detent Lock	Solder	1 A	-40 °C	85 °C
Molex 2147210161	Gold	Outer Shroud Contact	Gold	Header	30 V	Board	Right Angle Surface Mount	UL94 V-0	16	1	Solder Retention	0.063 in	0.031 in	All	3.94 µin	Black	Push-Pull	Solder	0 A	-40 °C	105 °C	Varies by Wire Gauge	Copper Alloy	Square	AC DC	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)