| Tin | Forked | Tin | Header | 30 V | Board Cable/Wire | Right Angle Surface Mount | UL94 V-0 | 4 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 39.4 µin | Black | Detent Lock | Solder | 1.5 A | -40 °C | 85 °C | | | | | | | | |
| Gold | Male Pin | Gold | Header | 30 V | Board | Right Angle Surface Mount | UL94 V-0 | 19 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 3.94 µin | Black | Push-Pull | Solder | 0 A | -40 °C | 105 °C | Varies by Wire Gauge | Copper Alloy | Square | AC DC | Shrouded - 4 Wall | Liquid Crystal Polymer (LCP) | | |
| Gold | Male Pin | Gold | Header | 30 V | Board | Right Angle Surface Mount | UL94 V-0 | 5 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 3.94 µin | Black | Push-Pull | Solder | 0 A | -40 °C | 105 °C | Varies by Wire Gauge | Copper Alloy | Square | AC DC | Shrouded - 4 Wall | Liquid Crystal Polymer (LCP) | | |
| Tin | Forked | Tin | Header | 30 V | Board Cable/Wire | Right Angle Surface Mount | UL94 V-0 | 3 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 39.4 µin | Black | Detent Lock | Solder | 1.5 A | -40 °C | 85 °C | | Copper Alloy | | | | Liquid Crystal Polymer (LCP) | General Purpose Telecommunications | 39.4 µin |
| Tin | Forked | Tin | Header | 30 V | Board Cable/Wire | Right Angle Surface Mount | UL94 V-0 | 20 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 39.4 µin | Black | Detent Lock | Solder | 1 A | -40 °C | 85 °C | | Copper Alloy | | | | Liquid Crystal Polymer (LCP) | General Purpose Telecommunications | 39.4 µin |
| Gold | Forked | Gold | Header | 30 V | Board Cable/Wire | Right Angle Surface Mount | UL94 V-0 | 10 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 3.94 µin | Black | Push-Pull | Solder | 0 A | -40 °C | 105 °C | Varies by Wire Gauge | | | AC DC | | | | |
| Gold | Male Pin | Gold | Header | 30 V | Board | Right Angle Surface Mount | UL94 V-0 | 3 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 3.94 µin | Black | Push-Pull | Solder | 0 A | -40 °C | 105 °C | Varies by Wire Gauge | Copper Alloy | Square | AC DC | Shrouded - 4 Wall | Liquid Crystal Polymer (LCP) | | |
| Tin | Forked | Tin | Header | 30 V | Board Cable/Wire | Right Angle Surface Mount | UL94 V-0 | 17 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 39.4 µin | Black | Detent Lock | Solder | 1 A | -40 °C | 85 °C | | Copper Alloy | | | | Liquid Crystal Polymer (LCP) | General Purpose Telecommunications | 39.4 µin |
| Tin | Forked | Tin | Header | 30 V | Board Cable/Wire | Right Angle Surface Mount | UL94 V-0 | 7 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 39.4 µin | Black | Detent Lock | Solder | 1 A | -40 °C | 85 °C | | | | | | | | |
| Gold | Outer Shroud Contact | Gold | Header | 30 V | Board | Right Angle Surface Mount | UL94 V-0 | 16 | 1 | Solder Retention | 0.063 in | 0.031 in | All | 3.94 µin | Black | Push-Pull | Solder | 0 A | -40 °C | 105 °C | Varies by Wire Gauge | Copper Alloy | Square | AC DC | Shrouded - 4 Wall | Liquid Crystal Polymer (LCP) | | |