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TDK-MLG0603S10NHTD25 Inductor Surface Mount Inductor RF Chip Unshielded Multi-Layer 0.01uH 3% 100MHz 5Q-Factor Ceramic 0.2A 0.8Ohm DCR 0201 T/R Automotive AEC-Q200

MLG0402P3N9BT000

Active
TDK Corporation

INDUCTOR RF CHIP UNSHIELDED MULTI-LAYER 0.0039UH 0.1NH 500MHZ 8Q-FACTOR CERAMIC 0.18A 1.2OHM DCR 01005 T/R

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TDK-MLG0603S10NHTD25 Inductor Surface Mount Inductor RF Chip Unshielded Multi-Layer 0.01uH 3% 100MHz 5Q-Factor Ceramic 0.2A 0.8Ohm DCR 0201 T/R Automotive AEC-Q200

MLG0402P3N9BT000

Active
TDK Corporation

INDUCTOR RF CHIP UNSHIELDED MULTI-LAYER 0.0039UH 0.1NH 500MHZ 8Q-FACTOR CERAMIC 0.18A 1.2OHM DCR 01005 T/R

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Description

General part information

MLG-P Series

INDUCTOR RF CHIP UNSHIELDED MULTI-LAYER 0.0039UH 0.1NH 500MHZ 8Q-FACTOR CERAMIC 0.18A 1.2OHM DCR 01005 T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationMLG0402P3N9BT000
Current Rating0.18 A
DC Resistance (DCR) (Max)1.2 Ohm
Frequency - Self Resonant6 GHz
Height - Seated (Max)0.009 in
Inductance3.9 nH
Inductance Frequency - Test500 MHz
Material - CoreNon-Magnetic
Mounting TypeSurface Mount
Operating Temperature (Max)125 °C
Operating Temperature (Min)-55 °C
Package / Case01005 (0402 Metric)
Package Name01005 (0402 Metric)
Q8
ShieldingUnshielded
Size / Dimension Length0.016 in
Size / Dimension Width0.008 in
Tolerance0.1 nH
TypeMultilayer

Pricing

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