W25Q512JVEIM TR
ActiveWinbond Electronics
IC FLASH 512MBIT SPI/QUAD 8WSON
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W25Q512JVEIM TR
ActiveWinbond Electronics
IC FLASH 512MBIT SPI/QUAD 8WSON
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25Q512JVEIM TR | W25Q512 Series |
|---|---|---|
| - | - | |
| Access Time | - | 6 ns |
| Clock Frequency | 133 MHz | 133 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | SPI - Quad I/O | SPI - Quad I/O, Quad I/O, QPI, SPI, DTR |
| Memory Organization | 64 M | 64 M |
| Memory Size | 64 MB | 64 MB |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 8-WDFN Exposed Pad | 16-SOIC, 24-TBGA, 8-WDFN Exposed Pad |
| Package / Case | - | 0.295 in |
| Package / Case | - | 7.5 mm |
| Supplier Device Package | 8-WSON (8x6) | 16-SOIC, 24-TFBGA (6x8), 8-WSON (8x6) |
| Technology | FLASH - NOR | FLASH - NOR, FLASH - NOR (SLC) |
| Voltage - Supply [Max] | 3.6 V | 1.95 - 3.6 V |
| Voltage - Supply [Min] | 2.7 V | 1.65 - 2.7 V |
| Write Cycle Time - Word, Page | - | 3 ms |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 4000 | $ 4.33 | |
W25Q512 Series
IC FLASH 512MBIT SPI/QUAD 16SOIC
| Part | Package / Case [x] | Package / Case | Package / Case [y] | Memory Size | Technology | Memory Organization | Memory Type | Mounting Type | Memory Format | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Memory Interface | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25Q512JVFIQ TR | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | ||
Winbond Electronics W25Q512JVFIM TR | ||||||||||||||||||
Winbond Electronics W25Q512JVBIQ | ||||||||||||||||||
Winbond Electronics W25Q512NWBIQ TR | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 1.65 V | 1.95 V | 24-TFBGA (6x8) | DTR, QPI, Quad I/O, SPI | 85 °C | -40 °C | 3 ms | 6 ns | ||
Winbond Electronics W25Q512JVBIM | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVBIQ | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVEIM | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVEIQ | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVFIQ | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | ||
Winbond Electronics W25Q512JVEIQ TR | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVEIM TR | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVFIM | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | ||
Winbond Electronics W25Q512JVBIQ TR | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512NWFIN TR | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR (SLC) | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 1.65 V | 1.95 V | 16-SOIC | DTR, QPI, Quad I/O, SPI | 85 °C | -40 °C | 3 ms | 6 ns |
Winbond Electronics W25Q512JVEIQ TR | ||||||||||||||||||
Winbond Electronics W25Q512JVFIM TR | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C |
Description
General part information
W25Q512 Series
FLASH - NOR Memory IC 512Mbit SPI - Quad I/O 133 MHz 8-WSON (8x6)
Documents
Technical documentation and resources