IC FLASH 512MBIT SPI/QUAD 16SOIC
Part | Package / Case [x] | Package / Case | Package / Case [y] | Memory Size | Technology | Memory Organization | Memory Type | Mounting Type | Memory Format | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Memory Interface | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page | Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25Q512JVFIQ TR | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | ||
Winbond Electronics W25Q512JVFIM TR | ||||||||||||||||||
Winbond Electronics W25Q512JVBIQ | ||||||||||||||||||
Winbond Electronics W25Q512NWBIQ TR | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 1.65 V | 1.95 V | 24-TFBGA (6x8) | DTR, QPI, Quad I/O, SPI | 85 °C | -40 °C | 3 ms | 6 ns | ||
Winbond Electronics W25Q512JVBIM | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVBIQ | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVEIM | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVEIQ | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVFIQ | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | ||
Winbond Electronics W25Q512JVEIQ TR | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVEIM TR | 8-WDFN Exposed Pad | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 8-WSON (8x6) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512JVFIM | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C | ||
Winbond Electronics W25Q512JVBIQ TR | 24-TBGA | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 24-TFBGA (6x8) | SPI - Quad I/O | 85 °C | -40 °C | ||||
Winbond Electronics W25Q512NWFIN TR | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR (SLC) | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 1.65 V | 1.95 V | 16-SOIC | DTR, QPI, Quad I/O, SPI | 85 °C | -40 °C | 3 ms | 6 ns |
Winbond Electronics W25Q512JVEIQ TR | ||||||||||||||||||
Winbond Electronics W25Q512JVFIM TR | 0.295 in | 16-SOIC | 7.5 mm | 64 MB | FLASH - NOR | 64 M | Non-Volatile | Surface Mount | FLASH | 133 MHz | 2.7 V | 3.6 V | 16-SOIC | SPI - Quad I/O | 85 °C | -40 °C |