Specification	XA3S400-4FGG456I

Grade	Automotive
Mounting Type	Surface Mount
Number of Gates	400000
Number of I/O	264
Number of LABs/CLBs	896
Number of Logic Elements/Cells	8064
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	456-BBGA
Package Length	23 mm
Package Name	456-FBGA
Package Width	23 mm
Qualification	AEC-Q100
Total RAM Bits	294912 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	1.14 V

XA3S400 Series

Part	Number of I/O	Package Width	Package Name	Package Length	Operating Temperature (Max)	Operating Temperature (Min)	Number of LABs/CLBs	Grade	Qualification	Package / Case	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Mounting Type	Number of Logic Elements/Cells	Total RAM Bits	Number of Gates
AMD / Xilinx XA3S400-4FGG456I	264	23 mm	456-FBGA	23 mm	100 °C	-40 °C	896	Automotive	AEC-Q100	456-BBGA	1.14 V	1.26 V	Surface Mount	8064	294912 bits	400000
AMD / Xilinx XA3S400-4FTG256Q	173	17 mm	256-FTBGA	17 mm	125 °C	-40 °C	896	Automotive	AEC-Q100	256-LBGA	1.14 V	1.26 V	Surface Mount	8064	294912 bits	400000

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