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TP0620N3-G - TO-92 / 3

TP0620N3-G

Active
Microchip Technology

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -200V, 12 OHM 3 TO-92 BAG ROHS COMPLIANT: YES

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TP0620N3-G - TO-92 / 3

TP0620N3-G

Active
Microchip Technology

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -200V, 12 OHM 3 TO-92 BAG ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTP0620N3-GTP0620 Series
Current - Continuous Drain (Id) @ 25°C-175 mA
Drain to Source Voltage (Vdss)-200 V
Drive Voltage (Max Rds On, Min Rds On)-10 V
Drive Voltage (Max Rds On, Min Rds On)-5 V
FET Type-P-Channel
Input Capacitance (Ciss) (Max) @ Vds-150 pF
Mounting Type-Through Hole
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-226-3, TO-92-3
Power Dissipation (Max)-1 W
Rds On (Max) @ Id, Vgs-12 Ohm
Supplier Device Package-TO-92-3
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-2.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBag 1$ 1.90
25$ 1.57
100$ 1.44
Microchip DirectBAG 1$ 1.90
25$ 1.57
100$ 1.44
1000$ 1.17
5000$ 1.11
10000$ 1.02
NewarkEach 100$ 1.49

TP0620 Series

MOSFET, P-Channel Enhancement-Mode, -200V, 12 Ohm

PartTechnologyDrain to Source Voltage (Vdss)Rds On (Max) @ Id, VgsDrive Voltage (Max Rds On, Min Rds On) [Max]Drive Voltage (Max Rds On, Min Rds On) [Min]Vgs(th) (Max) @ IdPackage / CaseSupplier Device PackageVgs (Max)Current - Continuous Drain (Id) @ 25°CInput Capacitance (Ciss) (Max) @ VdsOperating Temperature [Min]Operating Temperature [Max]Mounting TypePower Dissipation (Max)FET Type
Microchip Technology
TP0620N3-G
Microchip Technology
TP0620N3-G
MOSFET (Metal Oxide)
200 V
12 Ohm
10 V
5 V
2.4 V
TO-226-3, TO-92-3
TO-92-3
20 V
175 mA
150 pF
-55 °C
150 °C
Through Hole
1 W
P-Channel

Description

General part information

TP0620 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.