Specification	SPC5676RDK3MVY1

A/D Channels	64 count
A/D Resolution (bits)	12 bit
Connectivity	SPI, SCI, EMI, EBI, CANbus
Core Configuration	Dual-Core
Core Processor	e200z7
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	516-BBGA
Package Length	27 mm
Package Name	516-PBGA
Package Width	27 mm
Peripherals	POR, DMA, PWM
Program Memory Depth	6 M
Program Memory Size	6 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	384 K
RAM Size Width	8 bit
Speed	180 MHz
Voltage - Supply (Vcc/Vdd) Maximum	1.32 V
Voltage - Supply (Vcc/Vdd) Minimum	1.14 V

SPC5676 Series

Part	Connectivity	Speed	Oscillator Type	RAM Size Width	RAM Size Depth	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	A/D Channels	A/D Resolution (bits)	Core Size (Bit Width)	Core Configuration	Package / Case	Core Processor	Program Memory Size	Program Memory Width	Program Memory Depth	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Type	Mounting Type	Peripherals	Package Width	Package Name	Package Length
NXP USA Inc. SPC5676RDK3MVU1R	CANbus EBI EMI SCI SPI	180 MHz	Internal	8 bit	384 K	1.32 V	1.14 V	64 count	12 bit	32 Bit	Dual-Core	416-BBGA	e200z7	6 MB	8 bit	6 M	125 °C	-40 °C	FLASH	Surface Mount	DMA POR PWM	27 mm	416-PBGA	27 mm
NXP USA Inc. SPC5676RDK3MVY1	CANbus EBI EMI SCI SPI	180 MHz	Internal	8 bit	384 K	1.32 V	1.14 V	64 count	12 bit	32 Bit	Dual-Core	516-BBGA	e200z7	6 MB	8 bit	6 M	125 °C	-40 °C	FLASH	Surface Mount	DMA POR PWM	27 mm	516-PBGA	27 mm

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