Specification	96-9574-9515

Composition Elements	Sn, Cu
Composition Formula	Sn99.3Cu0.7
Cu Composition	0.7 %
Diameter	0.015 in
Form	Spool
Form Weight	17.64 oz
Melting Point	441 °F
Process	Lead Free
Shelf Life	36 Months
Shelf Life Start	Date of Manufacture
Sn Composition	99.3 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	28 SWG, 27 AWG

96-9574 Series

Part	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Shelf Life Start	Form Weight	Form	Melting Point	Sn Composition	Composition Formula	Composition Elements	Cu Composition	Wire Gauge	Type	Shelf Life	Diameter	Process
Kester Solder 96-9574-9540	50 °F	104 °F	Date of Manufacture	17.64 oz	Spool	441 °F	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	18 AWG 19 SWG	Wire Solder	36 Months	0.04 in	Lead Free
Kester Solder 96-9574-9520	50 °F	104 °F	Date of Manufacture	17.64 oz	Spool	441 °F	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	24 AWG 25 SWG	Wire Solder	36 Months	0.02 in	Lead Free
Kester Solder 96-9574-9531	50 °F	104 °F	Date of Manufacture	17.64 oz	Spool	441 °F	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	20 AWG 22 SWG	Wire Solder	36 Months	0.031 in	Lead Free
Kester Solder 96-9574-9525	50 °F	104 °F	Date of Manufacture	17.64 oz	Spool	441 °F	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	22 AWG 23 SWG	Wire Solder	36 Months	0.025 in	Lead Free
Kester Solder 96-9574-9515	50 °F	104 °F	Date of Manufacture	17.64 oz	Spool	441 °F	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	27 AWG 28 SWG	Wire Solder	36 Months	0.015 in	Lead Free

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