20-350001-10

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Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

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Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

Technical Specifications

Parameters and characteristics for this part

Specification	20-350001-10

Board Material	FR4 Epoxy Glass
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOJ
Convert To (Adapter End)	0.3 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	7.62 mm
Mounting Type	Through Hole
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in

Part	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Package Accepted	Number of Positions	Board Thickness	Board Thickness	Board Thickness	Proto Board Type	Pitch [x]	Pitch [x]	Material	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Mounting Type	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Board Material	Pitch - Post	Pitch - Post	Termination	Convert From (Adapter End)
Aries Electronics 20-350000-10	0.45 in	50.8 mm	2 in	11.43 mm	SOIC	20	0.062 in	0.0625 in	1.57 mm	SMD to DIP	0.05 in	1.27 mm	FR4 Epoxy Glass
Aries Electronics 20-350001-11-RC														0.3 in	DIP	7.62 mm	Through Hole	Brass	200 µin	5.08 µm	Tin	0.05 in	1.27 mm	3.18 mm	0.125 in	FR4 Epoxy Glass	2.54 mm	0.1 in	Solder	SOJ
Aries Electronics 20-350000-11-RC-P	0.45 in	50.8 mm	2 in	11.43 mm	SOIC	20	0.062 in	0.0625 in	1.57 mm	SMD to DIP	0.05 in	1.27 mm	FR4 Epoxy Glass
Aries Electronics 20-350000-10-HT														0.3 in	DIP	7.62 mm	Through Hole	Brass	200 µin	5.08 µm	Tin-Lead	0.05 in	1.27 mm	3.18 mm	0.125 in	Polyimide (PI)	2.54 mm	0.1 in	Solder	SOIC
Aries Electronics 20-350000-11-RC	0.45 in	50.8 mm	2 in	11.43 mm	SOIC	20	0.062 in	0.0625 in	1.57 mm	SMD to DIP	0.05 in	1.27 mm	FR4 Epoxy Glass
Aries Electronics 20-350001-10														0.3 in	DIP	7.62 mm	Through Hole	Brass	200 µin	5.08 µm	Tin	0.05 in	1.27 mm	3.18 mm	0.125 in	FR4 Epoxy Glass	2.54 mm	0.1 in	Solder	SOJ

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	220	$ 12.88