48-3551-11

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Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

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48-3551-11

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Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	48-3551-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	48
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

48-3551 Series

Part	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Type	Type	Type	Contact Material - Post	Current Rating (Amps)	Pitch - Post	Pitch - Post	Mounting Type	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Features	Termination	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3551-16	Nickel Boron	1.27 µm	50 µin	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder
Aries Electronics 48-3551-10	Tin	5.08 µm	200 µin		7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder
Aries Electronics 48-3551-18	Nickel Boron	1.27 µm	50 µin	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Nickel	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0	1.27 µm	50 µin	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	Beryllium Nickel	Closed Frame	Solder	-55 °C	250 °C
Aries Electronics 48-3551-11	Gold			Gold	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0			Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	18	$ 28.55

Description

General part information

48-3551 Series

48 (2 x 24) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources