PMEG6030EVP-QX
ActiveNexperia USA Inc.
DIODE SCHOTTKY 60V 3A 2-PIN CFPAK T/R
PMEG6030EVP-QX
ActiveNexperia USA Inc.
DIODE SCHOTTKY 60V 3A 2-PIN CFPAK T/R
Description
General part information
PMEG6030EVP-Q Series
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG6030EVP-QX |
|---|---|
| Capacitance | 575 pF |
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage | 400 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 175 °C |
| Package / Case | SOD-128 |
| Package Name | SOD-128/CFP5 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 20 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 475 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
PMEG6030EVP-Q Nexperia Product Reliability
Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation
plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body
Nexperia package poster
Evaluation of junction temperature and thermal stacks using the virtual junction
CFP封装的肖特基整流器
Questions about package outline drawings
Reflow soldering profile
Wave soldering guidelines for flatpack packages
Schottky rectifiers in CFP packages
Wave soldering profile
plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body