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UPR30E3/TR7 - DO-216

UPR30E3/TR7

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Microchip Technology

DIODE GEN PURP 300V 2A POWERMITE

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UPR30E3/TR7 - DO-216

UPR30E3/TR7

Active
Microchip Technology

DIODE GEN PURP 300V 2A POWERMITE

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Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationUPR30E3/TR7UPR30 Series
--
Current - Average Rectified (Io)2 A2 A
Current - Reverse Leakage @ Vr10 µA10 µA
Mounting TypeSurface MountSurface Mount
Operating Temperature - Junction [Max]150 °C150 °C
Operating Temperature - Junction [Min]-55 °C-55 °C
Package / CaseDO-216AADO-216AA
Reverse Recovery Time (trr)50 ns50 ns
Speed200 mA, 500 ns200 - 500 mA
Supplier Device PackagePowermitePowermite
TechnologyStandardStandard
Voltage - DC Reverse (Vr) (Max) [Max]300 V300 V
Voltage - Forward (Vf) (Max) @ If1.25 V1.25 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 3000$ 0.93

UPR30 Series

DIODE GEN PURP 300V 2A POWERMITE

PartCurrent - Reverse Leakage @ VrMounting TypeSupplier Device PackageTechnologyReverse Recovery Time (trr)Operating Temperature - Junction [Max]Operating Temperature - Junction [Min]Voltage - Forward (Vf) (Max) @ IfSpeedCurrent - Average Rectified (Io)Voltage - DC Reverse (Vr) (Max) [Max]Package / Case
Microchip Technology
UPR30/TR13
10 µA
Surface Mount
Powermite
Standard
50 ns
150 °C
-55 °C
1.25 V
200 mA, 500 ns
2 A
300 V
DO-216AA
Microchip Technology
UPR30E3/TR13
10 µA
Surface Mount
Powermite
Standard
50 ns
150 °C
-55 °C
1.25 V
200 mA, 500 ns
2 A
300 V
DO-216AA
Microchip Technology
UPR30E3/TR13
Microchip Technology
UPR30/TR7
10 µA
Surface Mount
Powermite
Standard
50 ns
150 °C
-55 °C
1.25 V
200 mA, 500 ns
2 A
300 V
DO-216AA
Microchip Technology
UPR30E3/TR7
10 µA
Surface Mount
Powermite
Standard
50 ns
150 °C
-55 °C
1.25 V
200 mA, 500 ns
2 A
300 V
DO-216AA

Description

General part information

UPR30 Series

Diode 300 V 2A Surface Mount Powermite

Documents

Technical documentation and resources

No documents available