
W25Q256FVFIF TR
ActiveWinbond Electronics
IC FLASH 256MBIT SPI/QUAD 16SOIC
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W25Q256FVFIF TR
ActiveWinbond Electronics
IC FLASH 256MBIT SPI/QUAD 16SOIC
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | W25Q256FVFIF TR | W25Q256 Series |
---|---|---|
- | - | |
Access Time | - | 6 - 7 ns |
Clock Frequency | 104 MHz | 104 - 133 MHz |
Memory Format | FLASH | FLASH |
Memory Interface | Quad I/O, QPI, SPI | Quad I/O, QPI, SPI, SPI - Quad I/O |
Memory Organization | 32 M | 32 M |
Memory Size | 256 Gbit | 256 Gbit |
Memory Type | Non-Volatile | Non-Volatile |
Mounting Type | Surface Mount | Surface Mount |
Operating Temperature [Max] | 85 °C | 85 - 105 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Package / Case | 16-SOIC | 16-SOIC, 8-WDFN Exposed Pad, 24-TBGA, 8-WLGA Exposed Pad, 63-VFBGA |
Package / Case [x] | 0.295 in | 0.295 in |
Package / Case [y] | 7.5 mm | 7.5 mm |
Supplier Device Package | 16-SOIC | 16-SOIC, 8-WSON (8x6), 24-TFBGA (6x8), 8-WFLGA (6x5), 63-VFBGA (9x11) |
Technology | FLASH - NOR | FLASH - NOR |
Voltage - Supply [Max] | 3.6 V | 1.95 - 3.6 V |
Voltage - Supply [Min] | 2.7 V | 1.7 - 2.7 V |
Write Cycle Time - Word, Page | - | 3 - 5 ms |
Write Cycle Time - Word, Page [custom] | 3 ms | 3 ms |
Write Cycle Time - Word, Page [custom] | 50 µs | 50 µs |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
W25Q256 Series
IC FLASH 256MBIT SPI/QUAD 16SOIC
Part | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Access Time | Memory Size | Memory Type | Memory Interface | Supplier Device Package | Technology | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Clock Frequency | Mounting Type | Package / Case [x] | Package / Case | Package / Case [y] | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Organization | Write Cycle Time - Word, Page |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25Q256FVFBQ | FLASH | 85 °C | -40 °C | 7 ns | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | |
Winbond Electronics W25Q256JVFIQ TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256JVEIM | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256JVEJM TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVFJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256FVFJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256JVFJM TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256FVCJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVEIG | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVFIQ TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256FVFJF | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256FVFIG TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256JVFIM | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256FVBIF TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVCIM | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVBJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVCIF | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVBJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEIP | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVBIQ | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVEIQ TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVFIF TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256FVCJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVMIM | FLASH | 85 °C | -40 °C | 6 ns | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WFLGA (6x5) | FLASH - NOR | 133 MHz | Surface Mount | 8-WLGA Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | ||||
Winbond Electronics W25Q256FVFJF TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256JVFIM TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256JVBJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVBIP | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVFIG | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256FVBIP TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JWBIQ TR | FLASH | 85 °C | -40 °C | 6 ns | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 1.7 V | 1.95 V | 32 M | 5 ms | ||||
Winbond Electronics W25Q256FVEJF | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVEJM | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVCIG TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVBIM | ||||||||||||||||||||
Winbond Electronics W25Q256JVBIM TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256JVBJM | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEIQ | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVCIG | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVCIQ TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVCIF TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVBJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVFJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256FVBBQ | FLASH | 85 °C | -40 °C | 7 ns | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 63-VFBGA (9x11) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 63-VFBGA | 2.7 V | 3.6 V | 32 M | |||
Winbond Electronics W25Q256JVEIQ TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256JVFJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256FVCIP | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVFIQ | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256JVEIQ | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVBIG TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVEJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEJQ | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVFIQ | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 16-SOIC | FLASH - NOR | 133 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | 3 ms | |||
Winbond Electronics W25Q256JVCIM TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEIG TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVEIM TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256JVBIM | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256JVCIQ | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVBIF | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 24-TFBGA (6x8) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256FVEIF | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVEJQ TR | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WSON (8x6) | FLASH - NOR | 133 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVFIF | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 16-SOIC | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 0.295 in | 16-SOIC | 7.5 mm | 2.7 V | 3.6 V | 32 M | ||
Winbond Electronics W25Q256JVMIQ | FLASH | 85 °C | -40 °C | 6 ns | 256 Gbit | Non-Volatile | SPI - Quad I/O | 8-WFLGA (6x5) | FLASH - NOR | 133 MHz | Surface Mount | 8-WLGA Exposed Pad | 2.7 V | 3.6 V | 32 M | 3 ms | ||||
Winbond Electronics W25Q256JVCJM | FLASH | 105 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEIP TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M | ||||
Winbond Electronics W25Q256JVBIQ TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH - NOR | 133 MHz | Surface Mount | 24-TBGA | 2.7 V | 3.6 V | 32 M | 3 ms | |||||
Winbond Electronics W25Q256FVEIF TR | FLASH | 85 °C | -40 °C | 256 Gbit | Non-Volatile | QPI, Quad I/O, SPI | 8-WSON (8x6) | FLASH - NOR | 3 ms | 50 µs | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 2.7 V | 3.6 V | 32 M |
Description
General part information
W25Q256 Series
FLASH - NOR Memory IC 256Mbit SPI - Quad I/O, QPI 104 MHz 16-SOIC
Documents
Technical documentation and resources