UPD70F3476AGJA-GAE-E2-G

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Renesas Electronics Corporation

IC MCU 32BIT 1.25MB FLSH 144LQFP

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Renesas Electronics Corporation

IC MCU 32BIT 1.25MB FLSH 144LQFP

Technical Specifications

Parameters and characteristics for this part

Specification	UPD70F3476AGJA-GAE-E2-G

Connectivity	EBI/EMI, CANbus, UART/USART, LINbus, I2C, CSI
Core Processor	V850E1
Core Size	32-Bit
Mounting Type	Surface Mount
Number of I/O	128
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	144-LQFP
Peripherals	WDT, DMA, LVD, PWM
Program Memory Size	1.25 MB
Program Memory Type	FLASH
RAM Size	92 K
Speed	48 MHz
Supplier Device Package	144-LQFP (20x20)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	2.85 V

IC MCU 32BIT 1.25MB FLSH 144LQFP

Part	Package / Case	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Program Memory Type	Peripherals	Core Size	Speed	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Program Memory Size	RAM Size	Number of I/O	Supplier Device Package	Oscillator Type	Connectivity	Core Processor
Renesas Electronics Corporation UPD70F3476AGJA-GAE-E2-G	144-LQFP	Surface Mount	85 °C	-40 °C	FLASH	DMA, LVD, PWM, WDT	32-Bit	48 MHz	3.6 V	2.85 V	1.25 MB	92 K	128	144-LQFP (20x20)	Internal	CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART	V850E1

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

V850E1 V850E/SJ3-H Microcontroller IC 32-Bit 48MHz 1.25MB (1.25M x 8) FLASH 144-LQFP (20x20)

Technical documentation and resources

No documents available