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33-0518-11H

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Aries Electronics

CONN SOCKET SIP 33POS GOLD

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33-0518-11H

Active
Aries Electronics

CONN SOCKET SIP 33POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification33-0518-11H
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)33
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
TypeSIP

33-0518 Series

PartMaterial Flammability RatingFeaturesContact Finish Thickness - PostContact Finish Thickness - PostPitch - PostPitch - PostContact Finish - PostMounting TypeTermination Post Length [x]Termination Post Length [x]TypeContact Finish Thickness - MatingContact Finish Thickness - MatingNumber of Positions or Pins (Grid)Contact Finish - MatingPitch - MatingPitch - MatingContact Material - MatingTerminationCurrent Rating (Amps)Contact Material - Post [custom]Housing MaterialTermination Post LengthTermination Post Length
Aries Electronics
UL94 V-0
Open Frame
200 µin
5.08 µm
2.54 mm
0.1 in
Tin
Surface Mount
0.046 in
1.17 mm
SIP
10 çin
0.25 çm
33
Gold
0.1 in
2.54 mm
Beryllium Copper
Solder
3 A
Brass
Glass Filled
Nylon 4/6
Polyamide (PA46)
Aries Electronics
UL94 V-0
Open Frame
200 µin
5.08 µm
2.54 mm
0.1 in
Tin
Through Hole
SIP
10 çin
0.25 çm
33
Gold
0.1 in
2.54 mm
Beryllium Copper
Solder
3 A
Brass
Glass Filled
Nylon 4/6
Polyamide (PA46)
3.18 mm
0.125 in
Aries Electronics
UL94 V-0
Open Frame
10 çin
0.25 çm
2.54 mm
0.1 in
Gold
Through Hole
SIP
10 çin
0.25 çm
33
Gold
0.1 in
2.54 mm
Beryllium Copper
Solder
3 A
Brass
Glass Filled
Nylon 4/6
Polyamide (PA46)
3.18 mm
0.125 in
Aries Electronics
UL94 V-0
Open Frame
200 µin
5.08 µm
2.54 mm
0.1 in
Tin
Through Hole
SIP
10 çin
0.25 çm
33
Gold
0.1 in
2.54 mm
Beryllium Copper
Solder
3 A
Brass
Glass Filled
Nylon 4/6
Polyamide (PA46)
3.18 mm
0.125 in
Aries Electronics
UL94 V-0
Open Frame
10 çin
0.25 çm
2.54 mm
0.1 in
Gold
Through Hole
SIP
10 çin
0.25 çm
33
Gold
0.1 in
2.54 mm
Beryllium Copper
Solder
3 A
Brass
Glass Filled
Nylon 4/6
Polyamide (PA46)
3.18 mm
0.125 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 60$ 8.04

Description

General part information

33-0518 Series

33 (1 x 33) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources