SMDLTLFP500T3C

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Chip Quik Inc.

SOLDER PASTE LOW TEMP T3 500G

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Active

Chip Quik Inc.

SOLDER PASTE LOW TEMP T3 500G

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 127.95

General part information

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)

Technical documentation and resources

Parameters and characteristics commom to parts in this series

Specification	SMDLTLFP500T3C	SMDLTL Series

Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Flux Type	No-Clean	No-Clean
Form	500 g, 17.64 oz	15 - 500 g
Form	Cartridge	Cartridge, Jar
Form	-	0.53 oz
Melting Point [custom]	138 °C	138 °C
Melting Point [custom]	281 °F	281 °F
Mesh Type	3	3
Mesh Type	-	4
Shelf Life	6 Months	6 - 24 Months
Shelf Life Start	Date of Manufacture	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature	-	37 °F
Storage/Refrigeration Temperature	-	25 °C
Storage/Refrigeration Temperature	-	3 °C
Storage/Refrigeration Temperature	-	77 °F
Type	Solder Paste	Solder Paste, Solder Paste, Two Part Mix

SOLDER PASTE LOW TEMP T4 500G

Part	Melting Point [custom]	Melting Point [custom]	Shelf Life Start	Mesh Type [custom]	Composition	Type	Flux Type	Form	Form	Shipping Info	Shelf Life	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Form	Mesh Type
Chip Quik Inc. SMDLTLFP500T4C	138 °C	281 °F	Date of Manufacture	4	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Solder Paste	No-Clean	17.64 oz, 500 g	Cartridge	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	6 Months
Chip Quik Inc. SMDLTLFP15T4	138 °C	281 °F	Date of Manufacture	4	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Solder Paste, Two Part Mix	No-Clean	15 g	Jar		24 Months	37 °F	25 °C	3 °C	77 °F	0.53 oz
Chip Quik Inc. SMDLTLFP500T3C	138 °C	281 °F	Date of Manufacture		Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Solder Paste	No-Clean	17.64 oz, 500 g	Cartridge	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	6 Months						3