8100-45-LF

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TWIN INDUSTRIES

BREADBOARD GENERAL PURPOSE

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TWIN INDUSTRIES

BREADBOARD GENERAL PURPOSE

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	8100-45-LF	8100 Series

Board Thickness	0.062 in	0.062 in
Board Thickness	0.0625 in	0.0625 in
Board Thickness	1.57 mm	1.57 mm
Circuit Pattern	Pad Per Hole (Round)	Pad Per Hole (Round)
Hole Diameter [diameter]	0.037 in	0.037 in
Hole Diameter [diameter]	0.94 mm	0.94 mm
Package Accepted	-	SSOP, TSOP, PSOP, TSSOP, SOIC, TQFP, QFP
Pitch [x]	2.54 mm	0.5 - 2.54 mm
Pitch [x]	0.1 in	0.02 - 0.1 in
Proto Board Type	Breadboard, General Purpose	Breadboard, General Purpose, SMD to DIP, SMD to Plated Through Hole Board
Size / Dimension	-	101.6 mm
Size / Dimension [x]	5 in	4.2 - 10 in
Size / Dimension [x]	127 mm	106.68 - 254 mm
Size / Dimension [y]	4 "	3.1 - 6 in
Size / Dimension [y]	101.6 mm	78.74 - 152.4 mm

BREADBOARD GENERAL PURPOSE

Part	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Pitch [x]	Pitch [x]	Board Thickness	Board Thickness	Board Thickness	Proto Board Type	Circuit Pattern	Hole Diameter [diameter]	Hole Diameter [diameter]	Package Accepted	Size / Dimension [y]
TWIN INDUSTRIES 8100-4565	165.1 mm	4.5 in	114.3 mm	6.5 in	2.54 mm	0.1 in	0.062 in	0.0625 in	1.57 mm	Breadboard, General Purpose	Pad Per Hole (Round)	0.037 in	0.94 mm
TWIN INDUSTRIES 8100-410	254 mm	4 "	101.6 mm	10 in	2.54 mm	0.1 in	0.062 in	0.0625 in	1.57 mm	Breadboard, General Purpose	Pad Per Hole (Round)	0.037 in	0.94 mm
TWIN INDUSTRIES 8100-SMT9	200.66 mm	3.1 in	78.74 mm	7.9 in			0.062 in	0.0625 in	1.57 mm	SMD to DIP				PSOP, SSOP, TSOP
TWIN INDUSTRIES 8100-SMT10	152.4 mm	4 "		6 in	0.5 mm	0.02 in	0.062 in	0.0625 in	1.57 mm	SMD to Plated Through Hole Board				TSSOP	101.6 mm
TWIN INDUSTRIES 8100-SMT8-LF	152.4 mm	4 "		6 in						SMD to Plated Through Hole Board				SOIC	101.6 mm
TWIN INDUSTRIES 8100-SMT8	152.4 mm	4 "		6 in	0.5 mm	0.02 in	0.062 in	0.0625 in	1.57 mm	SMD to Plated Through Hole Board				SOIC	101.6 mm
TWIN INDUSTRIES 8100-SMT3	152.4 mm	6 "	152.4 mm	6 in			0.062 in	0.0625 in	1.57 mm	SMD to Plated Through Hole Board
TWIN INDUSTRIES 8100-SMT14	152.4 mm	4 "		6 in						SMD to Plated Through Hole Board				TQFP	101.6 mm
TWIN INDUSTRIES 8100-SMT6	106.68 mm	4.2 "	106.68 mm	4.2 "			0.062 in	0.0625 in	1.57 mm	SMD to Plated Through Hole Board				SOIC
TWIN INDUSTRIES 8100-SMT11	152.4 mm	4 "		6 in			0.062 in	0.0625 in	1.57 mm	SMD to Plated Through Hole Board				QFP	101.6 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Breadboard, General Purpose Pad Per Hole (Round) 0.100" (2.54mm)

Technical documentation and resources