BREADBOARD GENERAL PURPOSE
| Part | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Pitch [x] | Pitch [x] | Board Thickness | Board Thickness | Board Thickness | Proto Board Type | Circuit Pattern | Hole Diameter [diameter] | Hole Diameter [diameter] | Package Accepted | Size / Dimension [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TWIN INDUSTRIES 8100-4565 | 165.1 mm | 4.5 in | 114.3 mm | 6.5 in | 2.54 mm | 0.1 in | 0.062 in | 0.0625 in | 1.57 mm | Breadboard, General Purpose | Pad Per Hole (Round) | 0.037 in | 0.94 mm | ||
TWIN INDUSTRIES 8100-SMT6 | 106.68 mm | 4.2 " | 106.68 mm | 4.2 " | 0.062 in | 0.0625 in | 1.57 mm | SMD to Plated Through Hole Board | SOIC | ||||||
TWIN INDUSTRIES 8100-SMT9 | 200.66 mm | 3.1 in | 78.74 mm | 7.9 in | 0.062 in | 0.0625 in | 1.57 mm | SMD to DIP | PSOP, SSOP, TSOP | ||||||
TWIN INDUSTRIES 8100-SMT10 | 152.4 mm | 4 " | 6 in | 0.5 mm | 0.02 in | 0.062 in | 0.0625 in | 1.57 mm | SMD to Plated Through Hole Board | TSSOP | 101.6 mm | ||||
TWIN INDUSTRIES 8100-SMT8 | 152.4 mm | 4 " | 6 in | 0.5 mm | 0.02 in | 0.062 in | 0.0625 in | 1.57 mm | SMD to Plated Through Hole Board | SOIC | 101.6 mm | ||||
TWIN INDUSTRIES 8100-SMT3 | 152.4 mm | 6 " | 152.4 mm | 6 in | 0.062 in | 0.0625 in | 1.57 mm | SMD to Plated Through Hole Board | |||||||
TWIN INDUSTRIES 8100-SMT11 | 152.4 mm | 4 " | 6 in | 0.062 in | 0.0625 in | 1.57 mm | SMD to Plated Through Hole Board | QFP | 101.6 mm | ||||||
TWIN INDUSTRIES 8100-45-LF | 127 mm | 4 " | 101.6 mm | 5 in | 2.54 mm | 0.1 in | 0.062 in | 0.0625 in | 1.57 mm | Breadboard, General Purpose | Pad Per Hole (Round) | 0.037 in | 0.94 mm | ||
TWIN INDUSTRIES 8100-SMT7 | 106.68 mm | 4.2 " | 106.68 mm | 4.2 " | 0.062 in | 0.0625 in | 1.57 mm | SMD to Plated Through Hole Board | SOIC | ||||||
TWIN INDUSTRIES 8100-SMT10-LF | 152.4 mm | 4 " | 6 in | SMD to Plated Through Hole Board | TSSOP | 101.6 mm |