HSS-C2591-SMT-TR

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CUI Devices

HEAT SINK TO-263 COPPER

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CUI Devices

HEAT SINK TO-263 COPPER

Technical Specifications

Parameters and characteristics for this part

Specification	HSS-C2591-SMT-TR

Fin Height	9.52 mm
Fin Height	0.375 in
Length [x]	15 mm
Length [x]	0.591 in
Material	Copper
Material Finish	Tin
Package Cooled [custom]	TO-263
Package Cooled [custom]	D²Pak
Power Dissipation @ Temperature Rise	2.1 W, 75 °C
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	200 LFM, 8.15 °C/W
Thermal Resistance @ Natural	35.71 °C/W
Type	Top Mount
Width [x]	1.02 "
Width [x]	25.91 mm

Part	Type	Shape	Material	Width [x]	Width [x]	Fin Height	Fin Height	Thermal Resistance @ Natural	Length [x]	Length [x]	Material Finish	Thermal Resistance @ Forced Air Flow	Power Dissipation @ Temperature Rise	Package Cooled [custom]	Package Cooled [custom]
CUI Devices HSS-C2591-SMT-TR	Top Mount	Rectangular Fins	Copper	1.02 "	25.91 mm	9.52 mm	0.375 in	35.71 °C/W	15 mm	0.591 in	Tin	8.15 °C/W 200 LFM	2.1 W 75 °C	TO-263	D²Pak

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	9000	$ 0.68

General part information

Heat Sink TO-263 (D²Pak) Copper 2.1W @ 75°C Top Mount

Technical documentation and resources