
BR25H512FVT-5ACE2
ActiveRohm Semiconductor
512KBIT, SPI BUS, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)

BR25H512FVT-5ACE2
ActiveRohm Semiconductor
512KBIT, SPI BUS, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
Description
General part information
BR25H512FVT-5AC Series
BR25H512xxx-5AC Series is a 512Kbit serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25H512FVT-5ACE2 |
|---|---|
| Clock Frequency | 20 MHz |
| Grade | Automotive |
| Memory Depth | 64 K |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 64 kB |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package Length | 0.173 in |
| Package Name | 8-TSSOP-B, 8-TSSOP |
| Package Width | 4.4 mm |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
What Is Thermal Design
BR25H512FVT-5AC Data Sheet
TSSOP-B8 Package Information
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Impedance Characteristics of Bypass Capacitor
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Thermal Resistance
Five Steps for Successful Thermal Design of IC
Opcode, Address, and Page Configuration for SPI BUS EEPROM
Solder Joint Rate and Thermal Resistance of Exposed Pad
Design Guide and Example of Stencil for Exposed Pad
Basics of Thermal Resistance and Heat Dissipation
Factory Information