TVS328E3
ActiveUNI-DIRECTIONAL TVS A-BODY ROHS COMPLIANT: YES
Deep-Dive with AI
Search across all available documentation for this part.
TVS328E3
ActiveUNI-DIRECTIONAL TVS A-BODY ROHS COMPLIANT: YES
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | TVS328E3 | TVS328-e3 Series |
|---|---|---|
| Applications | - | General Purpose |
| Current - Peak Pulse (10/1000µs) | - | 3.2 A |
| Mounting Type | - | Through Hole |
| null | - | |
| Operating Temperature | - | 175 ░C |
| Operating Temperature | - | -65 °C |
| Package / Case | - | A, Axial |
| Power - Peak Pulse | - | 150 W |
| Power Line Protection | - | False |
| Supplier Device Package | - | A, Axial |
| Type | - | Zener |
| Unidirectional Channels | - | 1 |
| Voltage - Breakdown (Min) | - | 30.7 V |
| Voltage - Clamping (Max) @ Ipp | - | 46 V |
| Voltage - Reverse Standoff (Typ) | - | 28 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Microchip Direct | N/A | 1 | $ 11.63 | |
| Newark | Each | 100 | $ 10.80 | |
| 500 | $ 10.39 | |||
TVS328-e3 Series
500W Transient Voltage Suppressor
| Part | Type | Applications | Power - Peak Pulse | Operating Temperature [Max] | Operating Temperature [Min] | Unidirectional Channels [custom] | Supplier Device Package | Voltage - Breakdown (Min) [Min] | Mounting Type | Power Line Protection | Voltage - Clamping (Max) @ Ipp [Max] | Current - Peak Pulse (10/1000µs) | Voltage - Reverse Standoff (Typ) | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology TVS328 | Zener | General Purpose | 150 W | 175 ░C | -65 °C | 1 | A, Axial | 30.7 V | Through Hole | 46 V | 3.2 A | 28 V | A, Axial | |
Microchip Technology TVS328E3 |
Description
General part information
TVS328-e3 Series
Microchips TVS Series of transient voltage suppressors feature oxide passivated Zener type chips with full-faced metallurgical bonds on both sides to achieve high surge capability and negligible electrical degradation under repeated surge conditions. The series is especially useful in protecting microprocessor, MOS, CMOS, TTL and linear integrated circuits from spurious transient disturbances.
Documents
Technical documentation and resources