264-1300-00-0602J

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CONN IC DIP SOCKET ZIF 64POS GLD

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CONN IC DIP SOCKET ZIF 64POS GLD

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	264-1300-00-0602J	264 Series

	-	-
Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	15 mOhm	15 - 25 mOhm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Open Frame, Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polyethersulfone (PES), Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Connector	Through Hole, Connector
Number of Positions or Pins (Grid)	64	64
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.07 in	0.02 - 0.1 in
Pitch - Mating	1.78 mm	0.5 - 2.54 mm
Pitch - Post	0.07 in	0.02 - 0.1 in
Pitch - Post	1.78 mm	0.5 - 2.54 mm
Termination	Press-Fit	Solder, Press-Fit
Termination Post Length	0.11 in	0.11 in
Termination Post Length	2.78 mm	2.78 mm
Termination Post Length	-	2.9 mm
Termination Post Length	-	0.114 in
Type	22.86 mm	22.86 mm
Type	DIP, ZIF (ZIP)	QFN, DIP, ZIF (ZIP)
Type	0.9 in	0.9 in

IC & COMPONENT SOCKET, 64 CONTACTS, QFN TEST SOCKET, 0.5 MM, 264 SERIES, BERYLLIUM COPPER

Part	Termination Post Length [x]	Termination Post Length [x]	Mounting Type	Number of Positions or Pins (Grid)	Contact Resistance	Contact Finish - Mating	Housing Material	Type	Termination	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Finish - Post	Features	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating
3M 264-5205-01	2.9 mm	0.114 in	Through Hole	64	25 mOhm	Gold	Polyethersulfone (PES)	QFN	Solder	Beryllium Copper	0.02 in	0.5 mm	Beryllium Copper	Gold	Open Frame	0.02 in	0.5 mm
3M 264-4493-00-0602J			Connector	64		Gold	Polysulfone (PSU), Glass Filled	DIP, ZIF (ZIP)	Press-Fit	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Gold	Closed Frame	0.1 in	2.54 mm	0.11 in	2.78 mm	30 µin	0.76 µm	22.86 mm	0.9 in	1 A	30 Áin	0.76 Ám	-55 °C	125 °C	UL94 V-0
3M 264-1300-00-0602J			Connector	64	15 mOhm	Gold	Polysulfone (PSU), Glass Filled	DIP, ZIF (ZIP)	Press-Fit	Beryllium Copper	0.07 in	1.78 mm	Beryllium Copper	Gold	Closed Frame	0.07 in	1.78 mm	0.11 in	2.78 mm	30 µin	0.76 µm	22.86 mm	0.9 in	1 A	30 Áin	0.76 Ám	-55 °C	125 °C	UL94 V-0
3M 264-4205-00

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

64 (2 x 32) Pos DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Socket Gold Connector

Technical documentation and resources